SLAS541L June   2007  – May 2020 MSP430F2416 , MSP430F2417 , MSP430F2418 , MSP430F2419 , MSP430F2616 , MSP430F2617 , MSP430F2618 , MSP430F2619

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagrams
  2. 2Revision History
  3. 3Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagrams
    2. 4.2 Signal Descriptions
      1. Table 4-1 Signal Descriptions
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Active Mode Supply Current Into VCC Excluding External Current
    5. 5.5  Typical Characteristics – Active Mode Supply Current (Into VCC)
    6. 5.6  Low-Power Mode Supply Currents (Into VCC) Excluding External Current
    7. 5.7  Typical Characteristics – LPM4 Current
    8. 5.8  Schmitt-Trigger Inputs (Ports P1 to P8, RST/NMI, JTAG, XIN, and XT2IN)
    9. 5.9  Inputs (Ports P1 and P2)
    10. 5.10 Leakage Current (Ports P1 to P8)
    11. 5.11 Standard Inputs (RST/NMI)
    12. 5.12 Outputs (Ports P1 to P8)
    13. 5.13 Output Frequency (Ports P1 to P8)
    14. 5.14 Typical Characteristics – Outputs
    15. 5.15 POR and Brownout Reset (BOR)
    16. 5.16 Typical Characteristics – POR and BOR
    17. 5.17 Supply Voltage Supervisor (SVS), Supply Voltage Monitor (SVM)
    18. 5.18 Main DCO Characteristics
    19. 5.19 DCO Frequency
    20. 5.20 Calibrated DCO Frequencies – Tolerance at Calibration
    21. 5.21 Calibrated DCO Frequencies – Tolerance Over Temperature 0°C to 85°C
    22. 5.22 Calibrated DCO Frequencies – Tolerance Over Supply Voltage VCC
    23. 5.23 Calibrated DCO Frequencies – Overall Tolerance
    24. 5.24 Typical Characteristics – Calibrated DCO Frequency
    25. 5.25 Wake-up Times From Lower-Power Modes (LPM3, LPM4)
    26. 5.26 Typical Characteristics – DCO Clock Wake-up Time From LPM3 or LPM4
    27. 5.27 DCO With External Resistor ROSC
    28. 5.28 Typical Characteristics – DCO With External Resistor ROSC
    29. 5.29 Crystal Oscillator LFXT1, Low-Frequency Mode
    30. 5.30 Internal Very-Low-Power Low-Frequency Oscillator (VLO)
    31. 5.31 Crystal Oscillator LFXT1, High-Frequency Mode
    32. 5.32 Typical Characteristics – LFXT1 Oscillator in HF Mode (XTS = 1)
    33. 5.33 Crystal Oscillator XT2
    34. 5.34 Typical Characteristics – XT2 Oscillator
    35. 5.35 Timer_A
    36. 5.36 Timer_B
    37. 5.37 USCI (UART Mode)
    38. 5.38 USCI (SPI Master Mode)
    39. 5.39 USCI (SPI Slave Mode)
    40. 5.40 USCI (I2C Mode)
    41. 5.41 Comparator_A+
    42. 5.42 Typical Characteristics, Comparator_A+
    43. 5.43 12-Bit ADC Power Supply and Input Range Conditions
    44. 5.44 12-Bit ADC External Reference
    45. 5.45 12-Bit ADC Built-In Reference
    46. 5.46 12-Bit ADC Timing Parameters
    47. 5.47 12-Bit ADC Linearity Parameters
    48. 5.48 12-Bit ADC Temperature Sensor and Built-In VMID
    49. 5.49 12-Bit DAC Supply Specifications
    50. 5.50 12-Bit DAC Linearity Specifications
    51. 5.51 Typical Characteristics, 12-Bit DAC Linearity Specifications
    52. 5.52 12-Bit DAC Output Specifications
    53. 5.53 12-Bit DAC Reference Input Specifications
    54. 5.54 12-Bit DAC Dynamic Specifications
    55. 5.55 Flash Memory
    56. 5.56 RAM
    57. 5.57 JTAG Interface
    58. 5.58 JTAG Fuse
  6. 6Detailed Description
    1. 6.1  CPU
    2. 6.2  Instruction Set
    3. 6.3  Operating Modes
    4. 6.4  Interrupt Vector Addresses
    5. 6.5  Special Function Registers (SFRs)
      1. Table 6-4 Interrupt Enable Register 1 Description
      2. Table 6-5 Interrupt Enable Register 2 Description
      3. Table 6-6 Interrupt Flag Register 1 Description
      4. Table 6-7 Interrupt Flag Register 2 Description
    6. 6.6  Memory Organization
    7. 6.7  Bootloader (BSL)
    8. 6.8  Flash Memory
    9. 6.9  Peripherals
      1. 6.9.1  DMA Controller (MSP430F261x Only)
      2. 6.9.2  Oscillator and System Clock
      3. 6.9.3  Calibration Data Stored in Information Memory Segment A
      4. 6.9.4  Brownout, Supply Voltage Supervisor (SVS)
      5. 6.9.5  Digital I/O
      6. 6.9.6  Watchdog Timer (WDT+)
      7. 6.9.7  Hardware Multiplier
      8. 6.9.8  Universal Serial Communication Interface (USCI)
      9. 6.9.9  Timer_A3
      10. 6.9.10 Timer_B7
      11. 6.9.11 Comparator_A+
      12. 6.9.12 ADC12
      13. 6.9.13 DAC12 (MSP430F261x Only)
      14. 6.9.14 Peripheral File Map
    10. 6.10 Port Diagrams
      1. 6.10.1  Port P1 (P1.0 to P1.7), Input/Output With Schmitt Trigger
      2. 6.10.2  Port P2 (P2.0 to P2.4, P2.6, and P2.7), Input/Output With Schmitt Trigger
      3. 6.10.3  Port P2 (P2.5), Input/Output With Schmitt Trigger
      4. 6.10.4  Port P3 (P3.0 to P3.7), Input/Output With Schmitt Trigger
      5. 6.10.5  Port P4 (P4.0 to P4.7), Input/Output With Schmitt Trigger
      6. 6.10.6  Port P5 (P5.0 to P5.7), Input/Output With Schmitt Trigger
      7. 6.10.7  Port P6 (P6.0 to P6.4), Input/Output With Schmitt Trigger
      8. 6.10.8  Port P6 (P6.5 and P6.6), Input/Output With Schmitt Trigger
      9. 6.10.9  Port P6 (P6.7), Input/Output With Schmitt Trigger
      10. 6.10.10 Port P7 (P7.0 to P7.7), Input/Output With Schmitt Trigger
      11. 6.10.11 Port P8 (P8.0 to P8.5), Input/Output With Schmitt Trigger
      12. 6.10.12 Port P8 (P8.6), Input/Output With Schmitt Trigger
      13. 6.10.13 Port P8 (P8.7), Input/Output With Schmitt Trigger
      14. 6.10.14 JTAG Pins (TMS, TCK, TDI/TCLK, TDO/TDI) Input/Output With Schmitt Trigger
      15. 6.10.15 JTAG Fuse Check Mode
  7. 7Device and Documentation Support
    1. 7.1  Getting Started
    2. 7.2  Device Nomenclature
    3. 7.3  Tools and Software
    4. 7.4  Documentation Support
    5. 7.5  Related Links
    6. 7.6  Community Resources
    7. 7.7  Trademarks
    8. 7.8  Electrostatic Discharge Caution
    9. 7.9  Export Control Notice
    10. 7.10 Glossary
  8. 8Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12-Bit ADC Temperature Sensor and Built-In VMID

over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS VCC MIN TYP MAX UNIT
ISENSOR Operating supply current into AVCC terminal (2) REFON = 0, INCH = 0Ah,
ADC12ON = 1, TA = 25°C
2.2 V 40 120 µA
3 V 60 160
VSENSOR Temperature sensor voltage(3)(1) ADC12ON = 1, INCH = 0Ah, TA = 0°C 2.2 V 986 mV
3 V 986
TCSENSOR Temperature coefficient(1) ADC12ON = 1, INCH = 0Ah 2.2 V 3.55 mV/°C
3 V 3.55
tSENSOR(sample) Sample time required if channel 10 is selected (4)(1) ADC12ON = 1, INCH = 0Ah,
Error of conversion result ≤ 1 LSB
2.2 V 30 µs
3 V 30
IVMID Current into divider at channel 11(5) ADC12ON = 1, INCH = 0Bh 2.2 V N/A(5) µA
3 V N/A(5)
VMID AVCC divider at channel 11 ADC12ON = 1, INCH = 0Bh,
VMID ≈ 0.5 × VAVCC
2.2 V 1.1 1.1 ±0.04 V
3 V 1.5 1.5 ±0.04
tVMID(sample) Sample time required if channel 11 is selected (6) ADC12ON = 1, INCH = 0Bh,
Error of conversion result ≤ 1 LSB
2.2 V 1400 ns
3 V 1220
Limits characterized
The sensor current ISENSOR is consumed if (ADC12ON = 1 and REFON = 1), or (ADC12ON = 1 AND INCH = 0Ah and sample signal is high). Therefore it includes the constant current through the sensor and the reference.
The temperature sensor offset can be as much as ±20°C. TI recommends a single-point calibration to minimize the offset error of the built-in temperature sensor.
The typical equivalent impedance of the sensor is 51 kΩ. The sample time required includes the sensor-on time tSENSOR(on)
No additional current is needed. The VMID is used during sampling.
The on-time tVMID(on) is included in the sampling time tVMID(sample), no additional on time is needed.