SLAS655F January   2010  – September 2018 MSP430F5418A , MSP430F5419A , MSP430F5435A , MSP430F5436A , MSP430F5437A , MSP430F5438A

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagrams
  2. 2Revision History
  3. 3Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagrams
    2. 4.2 Signal Descriptions
      1. Table 4-1 Signal Descriptions
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Active Mode Supply Current Into VCC Excluding External Current
    5. 5.5  Low-Power Mode Supply Currents (Into VCC) Excluding External Current
    6. 5.6  Thermal Resistance Characteristics
    7. 5.7  Schmitt-Trigger Inputs – General-Purpose I/O
    8. 5.8  Inputs – Ports P1 and P2
    9. 5.9  Leakage Current – General-Purpose I/O
    10. 5.10 Outputs – General-Purpose I/O (Full Drive Strength)
    11. 5.11 Outputs – General-Purpose I/O (Reduced Drive Strength)
    12. 5.12 Output Frequency – General-Purpose I/O
    13. 5.13 Typical Characteristics – Outputs, Reduced Drive Strength (PxDS.y = 0)
    14. 5.14 Typical Characteristics – Outputs, Full Drive Strength (PxDS.y = 1)
    15. 5.15 Crystal Oscillator, XT1, Low-Frequency Mode
    16. 5.16 Crystal Oscillator, XT1, High-Frequency Mode
    17. 5.17 Crystal Oscillator, XT2
    18. 5.18 Internal Very-Low-Power Low-Frequency Oscillator (VLO)
    19. 5.19 Internal Reference, Low-Frequency Oscillator (REFO)
    20. 5.20 DCO Frequency
    21. 5.21 PMM, Brownout Reset (BOR)
    22. 5.22 PMM, Core Voltage
    23. 5.23 PMM, SVS High Side
    24. 5.24 PMM, SVM High Side
    25. 5.25 PMM, SVS Low Side
    26. 5.26 PMM, SVM Low Side
    27. 5.27 Wake-up Times From Low-Power Modes and Reset
    28. 5.28 Timer_A
    29. 5.29 Timer_B
    30. 5.30 USCI (UART Mode) Clock Frequency
    31. 5.31 USCI (UART Mode)
    32. 5.32 USCI (SPI Master Mode) Clock Frequency
    33. 5.33 USCI (SPI Master Mode)
    34. 5.34 USCI (SPI Slave Mode)
    35. 5.35 USCI (I2C Mode)
    36. 5.36 12-Bit ADC, Power Supply and Input Range Conditions
    37. 5.37 12-Bit ADC, Timing Parameters
    38. 5.38 12-Bit ADC, Linearity Parameters Using an External Reference Voltage or AVCC as Reference Voltage
    39. 5.39 12-Bit ADC, Linearity Parameters Using the Internal Reference Voltage
    40. 5.40 12-Bit ADC, Temperature Sensor and Built-In VMID
    41. 5.41 REF, External Reference
    42. 5.42 REF, Built-In Reference
    43. 5.43 Flash Memory
    44. 5.44 JTAG and Spy-Bi-Wire Interface
  6. 6Detailed Description
    1. 6.1  CPU (Link to User's Guide)
    2. 6.2  Operating Modes
    3. 6.3  Interrupt Vector Addresses
    4. 6.4  Memory Organization
    5. 6.5  Bootloader (BSL)
    6. 6.6  JTAG Operation
      1. 6.6.1 JTAG Standard Interface
      2. 6.6.2 Spy-Bi-Wire Interface
    7. 6.7  Flash Memory (Link to User's Guide)
    8. 6.8  RAM (Link to User's Guide)
    9. 6.9  Peripherals
      1. 6.9.1  Digital I/O (Link to User's Guide)
      2. 6.9.2  Oscillator and System Clock (Link to User's Guide)
      3. 6.9.3  Power-Management Module (PMM) (Link to User's Guide)
      4. 6.9.4  Hardware Multiplier (MPY) (Link to User's Guide)
      5. 6.9.5  Real-Time Clock (RTC_A) (Link to User's Guide)
      6. 6.9.6  Watchdog Timer (WDT_A) (Link to User's Guide)
      7. 6.9.7  System Module (SYS) (Link to User's Guide)
      8. 6.9.8  DMA Controller (Link to User's Guide)
      9. 6.9.9  Universal Serial Communication Interface (USCI) (Links to User's Guide: UART Mode, SPI Mode, I2C Mode)
      10. 6.9.10 TA0 (Link to User's Guide)
      11. 6.9.11 TA1 (Link to User's Guide)
      12. 6.9.12 TB0 (Link to User's Guide)
      13. 6.9.13 ADC12_A (Link to User's Guide)
      14. 6.9.14 CRC16 (Link to User's Guide)
      15. 6.9.15 Reference (REF) Module Voltage Reference (Link to User's Guide)
      16. 6.9.16 Embedded Emulation Module (EEM) (L Version) (Link to User's Guide)
      17. 6.9.17 Peripheral File Map
    10. 6.10 Input/Output Diagrams
      1. 6.10.1  Port P1 (P1.0 to P1.7) Input/Output With Schmitt Trigger
      2. 6.10.2  Port P2 (P2.0 to P2.7) Input/Output With Schmitt Trigger
      3. 6.10.3  Port P3 (P3.0 to P3.7) Input/Output With Schmitt Trigger
      4. 6.10.4  Port P4 (P4.0 to P4.7) Input/Output With Schmitt Trigger
      5. 6.10.5  Port P5 (P5.0 and P5.1) Input/Output With Schmitt Trigger
      6. 6.10.6  Port P5 (P5.2 and P5.3) Input/Output With Schmitt Trigger
      7. 6.10.7  Port P5 (P5.4 to P5.7) Input/Output With Schmitt Trigger
      8. 6.10.8  Port P6 (P6.0 to P6.7) Input/Output With Schmitt Trigger
      9. 6.10.9  Port P7 (P7.0 and P7.1) Input/Output With Schmitt Trigger
      10. 6.10.10 Port P7 (P7.2 and P7.3) Input/Output With Schmitt Trigger
      11. 6.10.11 Port P7 (P7.4 to P7.7) Input/Output With Schmitt Trigger
      12. 6.10.12 Port P8 (P8.0 to P8.7) Input/Output With Schmitt Trigger
      13. 6.10.13 Port P9 (P9.0 to P9.7) Input/Output With Schmitt Trigger
      14. 6.10.14 Port P10 (P10.0 to P10.7) Input/Output With Schmitt Trigger
      15. 6.10.15 Port P11 (P11.0 to P11.2) Input/Output With Schmitt Trigger
      16. 6.10.16 Port PJ (PJ.0) JTAG Pin TDO, Input/Output With Schmitt Trigger or Output
      17. 6.10.17 Port PJ (PJ.1 to PJ.3) JTAG Pins TMS, TCK, TDI/TCLK, Input/Output With Schmitt Trigger or Output
    11. 6.11 Device Descriptors
  7. 7Device and Documentation Support
    1. 7.1  Getting Started
    2. 7.2  Device Nomenclature
    3. 7.3  Tools and Software
    4. 7.4  Documentation Support
    5. 7.5  Related Links
    6. 7.6  Community Resources
    7. 7.7  Trademarks
    8. 7.8  Electrostatic Discharge Caution
    9. 7.9  Export Control Notice
    10. 7.10 Glossary
  8. 8Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Documentation Support

The following documents describe the MSP430F543xA and MSP430F541xA MCUs. Copies of these documents are available on the Internet at www.ti.com.

Receiving Notification of Document Updates

To receive notification of documentation updates—including silicon errata—go to the product folder for your device on ti.com (for links to the product folders, see Section 7.5). In the upper right corner, click the "Alert me" button. This registers you to receive a weekly digest of product information that has changed (if any). For change details, check the revision history of any revised document.

Errata

User's Guides

    MSP430 Flash Device Bootloader (BSL) User's Guide

    The MSP430 bootloader (BSL) lets users communicate with embedded memory in the MSP430 microcontroller during the prototyping phase, final production, and in service. Both the programmable memory (flash memory) and the data memory (RAM) can be modified as required. Do not confuse the bootloader with the bootstrap loader programs found in some digital signal processors (DSPs) that automatically load program code (and data) from external memory to the internal memory of the DSP.

    MSP430 Programming With the JTAG Interface

    This document describes the functions that are required to erase, program, and verify the memory module of the MSP430 flash-based and FRAM-based microcontroller families using the JTAG communication port. In addition, it describes how to program the JTAG access security fuse that is available on all MSP430 devices. This document describes device access using both the standard 4-wire JTAG interface and the 2-wire JTAG interface, which is also referred to as Spy-Bi-Wire (SBW).

    MSP430 Hardware Tools User's Guide

    This manual describes the hardware of the TI MSP-FET430 Flash Emulation Tool (FET). The FET is the program development tool for the MSP430 ultra-low-power microcontroller. Both available interface types, the parallel port interface and the USB interface, are described.

Application Reports

    MSP430 32-kHz Crystal Oscillators

    Selection of the right crystal, correct load circuit, and proper board layout are important for a stable crystal oscillator. This application report summarizes crystal oscillator function and explains the parameters to select the correct crystal for MSP430 ultra-low-power operation. In addition, hints and examples for correct board layout are given. The document also contains detailed information on the possible oscillator tests to ensure stable oscillator operation in mass production.

    MSP430 System-Level ESD Considerations

    System-Level ESD has become increasingly demanding with silicon technology scaling towards lower voltages and the need for designing cost-effective and ultra-low-power components. This application report addresses three different ESD topics to help board designers and OEMs understand and design robust system-level designs.