SLASE45E October   2014  – December 2019 MSP430FR2032 , MSP430FR2033

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagrams
    2. 4.2 Signal Descriptions
    3. 4.3 Pin Multiplexing
    4. 4.4 Connection of Unused Pins
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Active Mode Supply Current Into VCC Excluding External Current
    5. 5.5  Active Mode Supply Current Per MHz
    6. 5.6  Low-Power Mode LPM0 Supply Currents Into VCC Excluding External Current
    7. 5.7  Low-Power Mode LPM3 and LPM4 Supply Currents (Into VCC) Excluding External Current
    8. 5.8  Low-Power Mode LPMx.5 Supply Currents (Into VCC) Excluding External Current
    9. 5.9  Typical Characteristics, Low-Power Mode Supply Currents
    10. 5.10 Typical Characteristics - Current Consumption Per Module
    11. 5.11 Thermal Characteristics
    12. 5.12 Timing and Switching Characteristics
      1. 5.12.1 Power Supply Sequencing
        1. Table 5-1 PMM, SVS and BOR
      2. 5.12.2 Reset Timing
        1. Table 5-2 Wake-Up Times From Low-Power Modes and Reset
      3. 5.12.3 Clock Specifications
        1. Table 5-3 XT1 Crystal Oscillator (Low Frequency)
        2. Table 5-4 DCO FLL, Frequency
        3. Table 5-5 REFO
        4. Table 5-6 Internal Very-Low-Power Low-Frequency Oscillator (VLO)
        5. Table 5-7 Module Oscillator Clock (MODCLK)
      4. 5.12.4 Digital I/Os
        1. Table 5-8 Digital Inputs
        2. Table 5-9 Digital Outputs
        3. 5.12.4.1  Digital I/O Typical Characteristics
      5. 5.12.5 Timer_A
        1. Table 5-10 Timer_A Recommended Operating Conditions
      6. 5.12.6 eUSCI
        1. Table 5-11 eUSCI (UART Mode) Recommended Operating Conditions
        2. Table 5-12 eUSCI (UART Mode) Switching Characteristics
        3. Table 5-13 eUSCI (SPI Master Mode) Recommended Operating Conditions
        4. Table 5-14 eUSCI (SPI Master Mode) Switching Characteristics
        5. Table 5-15 eUSCI (SPI Slave Mode) Switching Characteristics
        6. Table 5-16 eUSCI (I2C Mode) Switching Characteristics
      7. 5.12.7 ADC
        1. Table 5-17 ADC, Power Supply and Input Range Conditions
        2. Table 5-18 ADC, 10-Bit Timing Parameters
        3. Table 5-19 ADC, 10-Bit Linearity Parameters
      8. 5.12.8 FRAM
        1. Table 5-20 FRAM
      9. 5.12.9 Emulation and Debug
        1. Table 5-21 JTAG and Spy-Bi-Wire Interface Characteristics
  6. 6Detailed Description
    1. 6.1  CPU
    2. 6.2  Operating Modes
    3. 6.3  Interrupt Vector Addresses
    4. 6.4  Bootloader (BSL)
    5. 6.5  JTAG Standard Interface
    6. 6.6  Spy-Bi-Wire Interface (SBW)
    7. 6.7  FRAM
    8. 6.8  Memory Protection
    9. 6.9  Peripherals
      1. 6.9.1  Power Management Module (PMM) and On-chip Reference Voltages
      2. 6.9.2  Clock System (CS) and Clock Distribution
      3. 6.9.3  General-Purpose Input/Output Port (I/O)
      4. 6.9.4  Watchdog Timer (WDT)
      5. 6.9.5  System Module (SYS)
      6. 6.9.6  Cyclic Redundancy Check (CRC)
      7. 6.9.7  Enhanced Universal Serial Communication Interface (eUSCI_A0, eUSCI_B0)
      8. 6.9.8  Timers (Timer0_A3, Timer1_A3)
      9. 6.9.9  Real-Time Clock (RTC) Counter
      10. 6.9.10 10-Bit Analog Digital Converter (ADC)
      11. 6.9.11 Embedded Emulation Module (EEM)
      12. 6.9.12 Input/Output Diagrams
        1. 6.9.12.1  Port P1 Input/Output With Schmitt Trigger
        2. 6.9.12.2  Port P2 Input/Output With Schmitt Trigger
        3. 6.9.12.3  Port P3 Input/Output With Schmitt Trigger
        4. 6.9.12.4  Port P4.0 Input/Output With Schmitt Trigger
        5. 6.9.12.5  Port P4.1 and P4.2 Input/Output With Schmitt Trigger
        6. 6.9.12.6  Port 4.3, P4.4, P4.5, P4.6, and P4.7 Input/Output With Schmitt Trigger
        7. 6.9.12.7  Port P5.0, P5.1, P5.2, and P5.3 Input/Output With Schmitt Trigger
        8. 6.9.12.8  Port P5.4, P5.5, P5.6, and P5.7 Input/Output With Schmitt Trigger
        9. 6.9.12.9  Port P6.0, P6.1, P6.2, and P6.3 Input/Output With Schmitt Trigger
        10. 6.9.12.10 Port P6.4, P6.5, P6.6, and P6.7 Input/Output With Schmitt Trigger
        11. 6.9.12.11 Port P7.0, P7.1, P7.2, and P7.3 Input/Output With Schmitt Trigger
        12. 6.9.12.12 Port P7.4, P7.5, P7.6, and P7.7 Input/Output With Schmitt Trigger
        13. 6.9.12.13 Port P8.0 and P8.1 Input/Output With Schmitt Trigger
        14. 6.9.12.14 Port P8.2 and P8.3 Input/Output With Schmitt Trigger
    10. 6.10 Device Descriptors (TLV)
    11. 6.11 Memory
      1. 6.11.1 Peripheral File Map
    12. 6.12 Identification
      1. 6.12.1 Revision Identification
      2. 6.12.2 Device Identification
      3. 6.12.3 JTAG Identification
  7. 7Applications, Implementation, and Layout
    1. 7.1 Device Connection and Layout Fundamentals
      1. 7.1.1 Power Supply Decoupling and Bulk Capacitors
      2. 7.1.2 External Oscillator
      3. 7.1.3 JTAG
      4. 7.1.4 Reset
      5. 7.1.5 Unused Pins
      6. 7.1.6 General Layout Recommendations
      7. 7.1.7 Do's and Don'ts
    2. 7.2 Peripheral- and Interface-Specific Design Information
      1. 7.2.1 ADC Peripheral
        1. 7.2.1.1 Partial Schematic
        2. 7.2.1.2 Design Requirements
        3. 7.2.1.3 Layout Guidelines
  8. 8Device and Documentation Support
    1. 8.1 Getting Started
    2. 8.2 Device Nomenclature
    3. 8.3 Tools and Sofware
    4. 8.4 Documentation Support
    5. 8.5 Related Links
    6. 8.6 Community Resources
    7. 8.7 Trademarks
    8. 8.8 Electrostatic Discharge Caution
    9. 8.9 Glossary
  9. 9Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.9.2 Clock System (CS) and Clock Distribution

The clock system includes a 32-kHz crystal oscillator (XT1), an internal very low-power low-frequency oscillator (VLO), an integrated 32-kHz RC oscillator (REFO), an integrated internal digitally controlled oscillator (DCO) that may use frequency-locked loop (FLL) locking with internal or external 32-kHz reference clock, and on-chip asynchronous high-speed clock (MODCLK). The clock system is designed to target cost-effective designs with minimal external components. A fail-safe mechanism is designed for XT1. The clock system module offers the following clock signals.

  • Main Clock (MCLK): the system clock used by the CPU and all relevant peripherals accessed by the bus. All clock sources except MODCLK can be selected as the source with a predivider of 1, 2, 4, 8, 16, 32, 64, or 128.
  • Sub-Main Clock (SMCLK): the subsystem clock used by the peripheral modules. SMCLK derives from the MCLK with a predivider of 1, 2, 4, or 8. This means SMCLK is always equal to or less than MCLK.
  • Auxiliary Clock (ACLK): this clock is derived from the external XT1 clock or internal REFO clock up to 40 kHz.

All peripherals may have one or several clock sources depending on specific functionality. Table 6-6 shows the clock distribution used in this device.

Table 6-6 Clock Distribution

CLOCK SOURCE SELECT BITS MCLK SMCLK ACLK MODCLK XT1CLK(1) VLOCLK EXTERNAL PIN
Frequency Range DC to 16 MHz DC to 16 MHz DC to 40 kHz 5 MHz ±10% DC to 40 kHz 10 kHz ±50%
CPU N/A Default
FRAM N/A Default
RAM N/A Default
CRC N/A Default
I/O N/A Default
TA0 TASSEL 10b 01b 00b (TA0CLK pin)
TA1 TASSEL 10b 01b 00b (TA1CLK pin)
eUSCI_A0 UCSSEL 10b or 11b 01b 00b (UCA0CLK pin)
eUSCI_B0 UCSSEL 10b or 11b 01b 00b (UCB0CLK pin)
WDT WDTSSEL 00b 01b 10b
ADC ADCSSEL 10b or 11b 01b 00b
RTC RTCSS 01b 10b 11b
(1) To enable XT1 functionality, configure P4SEL0.1 (XIN) and P4SEL0.2 (XOUT) before configuring the Clock System registers.
MSP430FR2033 MSP430FR2032 cdm-slas865-fr203x.gifFigure 6-1 Clock Distribution Block Diagram