SLASEO7C
March 2019 – September 2021
MSP430FR2475
,
MSP430FR2476
PRODUCTION DATA
1
Features
2
Applications
3
Description
4
Functional Block Diagram
5
Revision History
6
Device Comparison
6.1
Related Products
7
Terminal Configuration and Functions
7.1
Pin Diagrams
7.2
Pin Attributes
7.3
Signal Descriptions
7.4
Pin Multiplexing
7.5
Buffer Types
7.6
Connection of Unused Pins
8
Specifications
8.1
Absolute Maximum Ratings
8.2
ESD Ratings
8.3
Recommended Operating Conditions
8.4
Active Mode Supply Current Into VCC Excluding External Current
8.5
Active Mode Supply Current Per MHz
8.6
Low-Power Mode LPM0 Supply Currents Into VCC Excluding External Current
8.7
Low-Power Mode (LPM3, LPM4) Supply Currents (Into VCC) Excluding External Current
8.8
Low-Power Mode LPMx.5 Supply Currents (Into VCC) Excluding External Current
8.9
Typical Characteristics – Low-Power Mode Supply Currents
8.10
Current Consumption Per Module
8.11
Thermal Resistance Characteristics
8.12
Timing and Switching Characteristics
8.12.1
Power Supply Sequencing
8.12.1.1
PMM, SVS and BOR
8.12.2
Reset Timing
8.12.2.1
Wake-up Times From Low-Power Modes and Reset
8.12.3
Clock Specifications
8.12.3.1
XT1 Crystal Oscillator (Low Frequency)
8.12.3.2
DCO FLL, Frequency
8.12.3.3
DCO Frequency
8.12.3.4
REFO
8.12.3.5
Internal Very-Low-Power Low-Frequency Oscillator (VLO)
8.12.3.6
Module Oscillator (MODOSC)
8.12.4
Digital I/Os
8.12.4.1
Digital Inputs
8.12.4.2
Digital Outputs
8.12.4.3
Typical Characteristics – Outputs at 3 V and 2 V
8.12.5
Internal Shared Reference
8.12.5.1
Internal Reference Characteristics
8.12.6
Timer_A and Timer_B
8.12.6.1
Timer_A
8.12.6.2
Timer_B
8.12.7
eUSCI
8.12.7.1
eUSCI (UART Mode) Clock Frequency
8.12.7.2
eUSCI (UART Mode) Timing Characteristics
8.12.7.3
eUSCI (SPI Master Mode) Clock Frequency
8.12.7.4
eUSCI (SPI Master Mode)
8.12.7.5
eUSCI (SPI Slave Mode)
8.12.7.6
eUSCI (I2C Mode)
8.12.8
ADC
8.12.8.1
ADC, Power Supply and Input Range Conditions
8.12.8.2
ADC, Timing Parameters
8.12.8.3
ADC, Linearity Parameters
8.12.9
Enhanced Comparator (eCOMP)
8.12.9.1
eCOMP0 Characteristics
8.12.10
FRAM
8.12.10.1
FRAM Characteristics
8.12.11
Debug and Emulation
8.12.11.1
JTAG, 4-Wire and Spy-Bi-Wire Interface
9
Detailed Description
9.1
Overview
9.2
CPU
9.3
Operating Modes
9.4
Interrupt Vector Addresses
9.5
Bootloader (BSL)
9.6
JTAG Standard Interface
9.7
Spy-Bi-Wire Interface (SBW)
9.8
FRAM
9.9
Memory Protection
9.10
Peripherals
9.10.1
Power-Management Module (PMM)
9.10.2
Clock System (CS) and Clock Distribution
9.10.3
General-Purpose Input/Output Port (I/O)
9.10.4
Watchdog Timer (WDT)
9.10.5
System (SYS) Module
9.10.6
Cyclic Redundancy Check (CRC)
9.10.7
Enhanced Universal Serial Communication Interface (eUSCI_A0, eUSCI_B0)
9.10.8
Timers (TA0, TA1, TA2, TA3 and TB0)
9.10.9
Hardware Multiplier (MPY)
9.10.10
Backup Memory (BAKMEM)
9.10.11
Real-Time Clock (RTC)
9.10.12
12-Bit Analog-to-Digital Converter (ADC)
9.10.13
eCOMP0
9.10.14
Embedded Emulation Module (EEM)
9.11
Input/Output Diagrams
9.11.1
Port P1 (P1.0 to P1.7) Input/Output With Schmitt Trigger
9.11.2
Port P2 (P2.0 to P2.7) Input/Output With Schmitt Trigger
9.11.3
Port P3 (P3.0 to P3.7) Input/Output With Schmitt Trigger
9.11.4
Port P4 (P4.0 to P4.7) Input/Output With Schmitt Trigger
9.11.5
Port P5 (P5.0 to P5.7) Input/Output With Schmitt Trigger
9.11.6
Port P6 (P6.0 to P6.2) Input/Output With Schmitt Trigger
9.12
Device Descriptors
9.13
Memory
9.13.1
Memory Organization
9.13.2
Peripheral File Map
9.14
Identification
9.14.1
Revision Identification
9.14.2
Device Identification
9.14.3
JTAG Identification
10
Applications, Implementation, and Layout
10.1
Device Connection and Layout Fundamentals
10.1.1
Power Supply Decoupling and Bulk Capacitors
10.1.2
External Oscillator
10.1.3
JTAG
10.1.4
Reset
10.1.5
Unused Pins
10.1.6
General Layout Recommendations
10.1.7
Do's and Don'ts
10.2
Peripheral- and Interface-Specific Design Information
10.2.1
ADC Peripheral
10.2.1.1
Partial Schematic
10.2.1.2
Design Requirements
10.2.1.3
Layout Guidelines
11
Device and Documentation Support
11.1
Getting Started and Next Steps
11.2
Device Nomenclature
11.3
Tools and Software
11.4
Documentation Support
11.5
Support Resources
11.6
Trademarks
11.7
Electrostatic Discharge Caution
11.8
Export Control Notice
11.9
Glossary
12
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
PT|48
MTQF003C
RHB|32
MPQF130D
RHA|40
MPQF135D
Thermal pad, mechanical data (Package|Pins)
RHB|32
QFND029X
RHA|40
QFND027R
Orderable Information
slaseo7c_oa
slaseo7c_pm
8.12.4
Digital I/Os