SLAS887B September   2014  – March 2020

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagrams
    2. 4.2 Signal Descriptions
      1. Table 4-1 Signal Descriptions
    3. 4.3 Pin Multiplexing
    4. 4.4 Connection of Unused Pins
  5. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Active Mode Supply Current (Into VCC) Excluding External Current
    5. 5.5 Low-Power Mode Supply Currents (Into VCC) Excluding External Current
    6. 5.6 Thermal Resistance Characteristics
    7. 5.7 Timing and Switching Characteristics
      1. 5.7.1  Reset Timing
        1. Table 5-1 Reset Timing
      2. 5.7.2  Clock Specifications
        1. Table 5-2 DCO in External Resistor Mode
        2. Table 5-3 DCO in Internal Resistor Mode
        3. Table 5-4 DCO Overall Tolerance Table
        4. Table 5-5 DCO in Bypass Mode Recommended Operating Conditions
      3. 5.7.3  Wake-up Characteristics
        1. Table 5-6 Wake-up Times From Low Power Modes
      4. 5.7.4  I/O Ports
        1. Table 5-7  Schmitt-Trigger Inputs – General-Purpose I/O
        2. Table 5-8  Inputs – Ports P1 and P2
        3. Table 5-9  Leakage Current – General-Purpose I/O
        4. Table 5-10 Outputs – General-Purpose I/O
        5. Table 5-11 Output Frequency – General-Purpose I/O
        6. 5.7.4.1    Typical Characteristics – Outputs
      5. 5.7.5  Power Management Module
        1. Table 5-12 PMM, High-Side Brownout Reset (BORH)
        2. Table 5-13 PMM, Low-Side SVS (SVSL)
        3. Table 5-14 PMM, Core Voltage
        4. Table 5-15 PMM, Voltage Monitor (VMON)
      6. 5.7.6  Reference Module
        1. Table 5-16 Voltage Reference (REF)
        2. Table 5-17 Temperature Sensor
      7. 5.7.7  SD24
        1. Table 5-18 SD24 Power Supply and Recommended Operating Conditions
        2. Table 5-19 SD24 Internal Voltage Reference
        3. Table 5-20 SD24 External Voltage Reference
        4. Table 5-21 SD24 Input Range
        5. Table 5-22 SD24 Performance, Internal Reference (SD24REFS = 1, SD24OSRx = 256)
        6. Table 5-23 SD24 Performance, External Reference (SD24REFS = 0, SD24OSRx = 256)
      8. 5.7.8  eUSCI
        1. Table 5-24 eUSCI (UART Mode) Clock Frequency
        2. Table 5-25 eUSCI (UART Mode) Deglitch Characteristics
        3. Table 5-26 eUSCI (SPI Master Mode) Clock Frequency
        4. Table 5-27 eUSCI (SPI Master Mode) Timing
        5. Table 5-28 eUSCI (SPI Slave Mode) Timing
        6. Table 5-29 eUSCI (I2C Mode) Timing
      9. 5.7.9  Timer_A
        1. Table 5-30 Timer_A
      10. 5.7.10 Flash
        1. Table 5-31 Flash Memory
      11. 5.7.11 Emulation and Debug
        1. Table 5-32 JTAG and Spy-Bi-Wire Interface
  6. 6Detailed Description
    1. 6.1  Overview
    2. 6.2  Functional Block Diagrams
    3. 6.3  CPU
    4. 6.4  Instruction Set
    5. 6.5  Operating Modes
    6. 6.6  Interrupt Vector Addresses
    7. 6.7  Special Function Registers
      1. Table 6-4 Interrupt Enable 1 (Address = 00h)
      2. Table 6-5 Interrupt Flag Register 1 (Address = 02h)
    8. 6.8  Flash Memory
    9. 6.9  JTAG Operation
      1. 6.9.1 JTAG Standard Interface
      2. 6.9.2 Spy-Bi-Wire Interface
      3. 6.9.3 JTAG Disable Register
        1. Table 6-1 SYSJTAGDIS Register
    10. 6.10 Peripherals
      1. 6.10.1 Clock System
      2. 6.10.2 Power-Management Module (PMM)
      3. 6.10.3 Digital I/O
      4. 6.10.4 Watchdog Timer (WDT)
      5. 6.10.5 Timer TA0
      6. 6.10.6 Timer TA1
      7. 6.10.7 Enhanced Universal Serial Communication Interface (eUSCI)
      8. 6.10.8 Hardware Multiplier
      9. 6.10.9 SD24
    11. 6.11 Input/Output Diagrams
      1. 6.11.1 Port P1, P1.0 to P1.3, Input/Output With Schmitt Trigger
      2. 6.11.2 Port P1, P1.4 to P1.7, Input/Output With Schmitt Trigger
      3. 6.11.3 Port P2, P2.0 to P2.2 and P2.4 to P2.7, Input/Output With Schmitt Trigger
      4. 6.11.4 Port P2, P2.3, Input/Output With Schmitt Trigger
    12. 6.12 Device Descriptor
    13. 6.13 Memory
      1. 6.13.1 Peripheral File Map
    14. 6.14 Identification
      1. 6.14.1 Device Identification
      2. 6.14.2 JTAG Identification
  7. 7Applications, Implementation, and Layout
  8. 8Device and Documentation Support
    1. 8.1 Getting Started and Next Steps
    2. 8.2 Device Nomenclature
    3. 8.3 Tools and Software
    4. 8.4 Documentation Support
    5. 8.5 Related Links
    6. 8.6 Support Resources
    7. 8.7 Trademarks
    8. 8.8 Electrostatic Discharge Caution
    9. 8.9 Glossary
  9. 9Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Description

The Texas Instruments MSP430i204x, MSP430I203x and MSP430I202x microcontrollers (MCUs) are part of the MSP430™ Metrology and Monitoring portfolio. The architecture and integrated peripherals, combined with five extensive low-power modes, are optimized to achieve extended battery life in portable and battery-powered measurement applications. The devices feature a powerful 16-bit RISC CPU, 16-bit registers, and constant generators that contribute to maximum code efficiency. The digitally controlled oscillator (DCO) allows the devices to wake up from low-power modes to active mode in less than 5 µs.

The MSP430i204x MCUs include four high-performance 24-bit sigma-delta ADCs, two eUSCIs (one eUSCI_A module and one eUSCI_B module), two 16-bit timers, a hardware multiplier, and up to 16 I/O pins.

The MSP430I203x MCUs include three high-performance 24-bit sigma-delta ADCs, two eUSCIs (one eUSCI_A module and one eUSCI_B module), two 16-bit timers, a hardware multiplier, and up to 16 I/O pins.

The MSP430I202x MCUs include two high-performance 24-bit sigma-delta ADCs, two eUSCIs (one eUSCI_A module and one eUSCI_B module), two 16-bit timers, a hardware multiplier, and up to 16 I/O pins.

Typical applications for these devices include energy measurement, analog and digital sensor systems, LED lighting, digital power supplies, motor controls, remote controls, thermostats, digital timers, and hand-held meters.

The MSP430i204x, MSP430I203x and MSP430I202x MCUs are supported by an extensive hardware and software ecosystem with reference designs and code examples to get your design started quickly. Development kits include the EVM430-I2040S evaluation module (EVM) for metering and the MSP-TS430RHB32A 100-pin target development board. The Energy Measurement Design Center for MSP430 MCUs is provided as a rapid development tool that enables energy measurement on these devices. TI also provides free MSP430Ware™ software, which is available as a component of Code Composer Studio™ IDE desktop and cloud versions within TI Resource Explorer. The MSP430 MCUs are also supported by extensive online collateral, training, and online support through the TI E2E™ support forums.

For complete module descriptions, see the MSP430i2xx Family User's Guide.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE(2)
MSP430i2041TPW TSSOP (28) 9.7 mm × 4.4 mm
MSP430i2041TRHB VQFN (32) 5 mm × 5 mm
For the most current part, package, and ordering information for all available devices, see the Package Option Addendum in Section 9, or see the TI website at www.ti.com.
The sizes shown here are approximations. For the package dimensions with tolerances, see the Mechanical Data in Section 9.