2 Revision History
Changes from revision A to revision B
Changes from May 3, 2018 to March 3, 2020
- Updated Section 1.1, FeaturesGo
- Updated Section 1.3, DescriptionGo
- Added 2 and 4 to the SD24GAINx options in the test conditions of the "Gain error" parameter in Table 5-22, SD24 Performance, Internal Reference (SD24REFS = 1, SD24OSRx = 256)Go
- Added 2 and 4 to the SD24GAINx options in the test conditions of the "Gain error" parameter in Table 5-23, SD24 Performance, External Reference (SD24REFS = 0, SD24OSRx = 256)Go
- Changed the MIN values for the tHD,STA, tSU,STA, tHD,DAT, tSU,DAT, and tSU,STO parameters in Table 5-29, eUSCI (I2C Mode) TimingGo
- Updated descriptions and links in Section 7, Applications, Implementation, and LayoutGo
Changes from August 31, 2014 to May 2, 2018
- Changed the list of applications in Section 1.2, ApplicationsGo
- Added Section 3.1, Related ProductsGo
- Added typical conditions statements at the beginning of Section 5, SpecificationsGo
- Added SD24 input pins and AUXVCCx pins to exception list on "Voltage applied to pins" parameter, and added SD24 input pin limits in "Diode current at pins" parameter in Section 5.1, Absolute Maximum RatingsGo
- Added Section 5.2, ESD RatingsGo
- Added Section 5.6, Thermal Resistance CharacteristicsGo
- Changed the MAX value of the tWAKE-UP-LPM4 parameter from 35 µs to 45 µs in Table 5-6, Wake-up Times From Low Power ModesGo
- Added the CAUTION that begins "The CPU will lock up if..." in Section 6.3, CPUGo
- Updated Section 8, Device and Documentation Support, with device-specific information and linksGo