SLASFA2B November   2024  – October 2025 MSPM0G1518 , MSPM0G1519 , MSPM0G3518 , MSPM0G3519

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Device Comparison
    1. 5.1 Device Comparison Chart
  7. 6 Pin Configuration and Functions
    1. 6.1 Pin Diagrams
    2. 6.2 Pin Attributes
      1.      11
    3. 6.3 Signal Descriptions
      1.      13
      2.      14
      3.      15
      4.      16
      5.      17
      6.      18
      7.      19
      8.      20
      9.      21
      10.      22
      11.      23
      12.      24
      13.      25
      14.      26
      15.      27
      16.      28
      17.      29
    4. 6.4 Connections for Unused Pins
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Supply Current Characteristics
      1. 7.5.1 RUN/SLEEP Modes
      2. 7.5.2 STOP/STANDBY Modes
      3. 7.5.3 SHUTDOWN Mode
    6. 7.6  Power Supply Sequencing
      1. 7.6.1 Power Supply Ramp
      2. 7.6.2 POR and BOR
    7. 7.7  Flash Memory Characteristics
    8. 7.8  Timing Characteristics
    9. 7.9  Clock Specifications
      1. 7.9.1 System Oscillator (SYSOSC)
      2. 7.9.2 Low Frequency Oscillator (LFOSC)
      3. 7.9.3 System Phase Lock Loop (SYSPLL)
      4. 7.9.4 Low Frequency Crystal/Clock
      5. 7.9.5 High Frequency Crystal/Clock
    10. 7.10 Digital IO
      1. 7.10.1  Electrical Characteristics
      2. 7.10.2 Switching Characteristics
    11. 7.11 Analog Mux VBOOST
    12. 7.12 ADC
      1. 7.12.1 Electrical Characteristics
      2. 7.12.2 Switching Characteristics
      3. 7.12.3 Linearity Parameters
      4. 7.12.4 Typical Connection Diagram
    13. 7.13 Temperature Sensor
    14. 7.14 VREF
      1. 7.14.1 Voltage Characteristics
      2. 7.14.2 Electrical Characteristics
    15. 7.15 Comparator (COMP)
      1. 7.15.1 Comparator Electrical Characteristics
    16. 7.16 DAC
      1. 7.16.1 DAC_Supply Specifications
      2. 7.16.2 DAC Output Specifications
      3. 7.16.3 DAC Dynamic Specifications
      4. 7.16.4 DAC Linearity Specifications
      5. 7.16.5 DAC Timing Specifications
    17. 7.17 I2C
      1. 7.17.1 I2C Characteristics
      2. 7.17.2 I2C Filter
      3. 7.17.3 I2C Timing Diagram
    18. 7.18 SPI
      1. 7.18.1 SPI
      2. 7.18.2 SPI Timing Diagram
    19. 7.19 UART
    20. 7.20 TIMx
    21. 7.21 TRNG
      1. 7.21.1 TRNG Electrical Characteristics
      2. 7.21.2 TRNG Switching Characteristics
    22. 7.22 Emulation and Debug
      1. 7.22.1 SWD Timing
  9. 8 Detailed Description
    1. 8.1  Functional Block Diagram
    2. 8.2  CPU
    3. 8.3  Operating Modes
      1. 8.3.1 Functionality by Operating Mode (MSPM0Gx51x)
    4. 8.4  Power Management Unit (PMU)
    5. 8.5  Clock Module (CKM)
    6. 8.6  DMA
    7. 8.7  Events
    8. 8.8  Memory
      1. 8.8.1 Memory Organization
      2. 8.8.2 Peripheral File Map
      3. 8.8.3 Peripheral Interrupt Vector
    9. 8.9  Flash Memory
    10. 8.10 SRAM
    11. 8.11 GPIO
    12. 8.12 IOMUX
    13. 8.13 ADC
    14. 8.14 Temperature Sensor
    15. 8.15 VREF
    16. 8.16 COMP
    17. 8.17 DAC
    18. 8.18 Security
    19. 8.19 TRNG
    20. 8.20 AESADV
    21. 8.21 Keystore
    22. 8.22 CRC-P
    23. 8.23 MATHACL
    24. 8.24 UART
    25. 8.25 I2C
    26. 8.26 SPI
    27. 8.27 CAN-FD
    28. 8.28 Low-Frequency Sub System (LFSS)
    29. 8.29 RTC_B
    30. 8.30 IWDT_B
    31. 8.31 WWDT
    32. 8.32 Timers (TIMx)
    33. 8.33 Device Analog Connections
    34. 8.34 Input/Output Diagrams
    35. 8.35 Serial Wire Debug Interface
    36. 8.36 Boot Strap Loader (BSL)
    37. 8.37 Device Factory Constants
    38. 8.38 Identification
  10. 9 Applications, Implementation, and Layout
    1. 9.1 Typical Application
      1. 9.1.1 Schematic
  11. 10Device and Documentation Support
    1. 10.1 Getting Started and Next Steps
    2. 10.2 Device Nomenclature
    3. 10.3 Tools and Software
    4. 10.4 Documentation Support
    5. 10.5 Support Resources
    6. 10.6 Trademarks
    7. 10.7 Electrostatic Discharge Caution
    8. 10.8 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Tray Information
    2.     PACKAGE OPTION ADDENDUM

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • ZAW|100
  • PM|64
  • RGZ|48
  • RHB|32
  • PN|80
  • PZ|100
  • PT|48
Thermal pad, mechanical data (Package|Pins)
Orderable Information

3 Description

MSPM0Gx51x microcontrollers (MCUs) are part of the MSP highly integrated, ultra-low-power 32-bit MCU family based on the enhanced Arm®Cortex®-M0+ 32-bit core platform, operating at up to 80MHz frequency. These MCUs offer a blend of cost optimization and design flexibility for applications requiring 256KB to 512KB of flash memory in small packages or high pin count packages (up to 100 pins). These devices include dual CAN-FD controllers, cybersecurity enablers, high performance integrated analog, and provide excellent low power performance across the operating temperature range.

The device has up to 512KB of embedded flash program memory with built-in error correction code (ECC) and up to 128KB SRAM (with ECC and parity protection for the first 64kB). The flash memory is organized into two main banks to support field firmware updates, with address swap support provided between the two main banks.

Flexible cybersecurity enablers can be used to support secure boot, secure in-field firmware updates, IP protection (execute-only memory), key storage, and more. Hardware acceleration is provided for a variety of AES symmetric cipher modes, as well as a TRNG entropy source. The cybersecurity architecture is pending Arm® PSA Level 1 certification.

A set of high performance analog modules is provided, such as two simultaneously sampling 12-bit, 4Msps ADCs supporting up to 27 external channels, on-chip voltage reference (1.4V or 2.5V), one 12-bit 1Msps DAC, and three comparators operable in low-power and high-speed modes with additional built-in 8-bit reference DACs .

The TI MSPM0 family of low-power MCUs consists of devices with varying degrees of analog and digital integration allowing for customers find the MCU that meets their project's needs. The MSPM0 MCU platform combines the Arm Cortex-M0+ platform with a holistic ultra-low-power system architecture, allowing system designers to increase performance while reducing energy consumption.

MSPM0Gx51x MCUs are supported by an extensive hardware and software ecosystem with reference designs and code examples to get the design started quickly. Development kits include a LaunchPad available for purchase. TI also provides a free MSPM0 Software Development Kit (SDK), which is available as a component of Code Composer Studio™ IDE desktop and cloud version within the TI Resource Explorer. MSPM0 MCUs are also supported by extensive online collateral, training with MSP Academy, and online support through the TI E2E™ support forums.

For complete module descriptions, see the MSPM0 G-Series 80MHz Microcontrollers Technical Reference Manual.

CAUTION:

System-level ESD protection must be applied in compliance with the device-level ESD specification to prevent electrical overstress or disturbing of data or code memory. See MSP430™ System-Level ESD Considerations for more information. The principles in this application note are applicable to MSPM0 MCUs.

Device Information
PART NUMBERPACKAGE(1)PACKAGE SIZE(2)

MSPM0G1518SZAWR

ZAW (nFBGA, 100)

9mm x 9mm

MSPM0G1519SZAWR

MSPM0G3518SZAWR

MSPM0G3519SZAWR

MSPM0G1518SPZR

PZ (LQFP, 100)

16mm x 16mm

MSPM0G1519SPZR

MSPM0G3518SPZR

MSPM0G3519SPZR

MSPM0G1518SPNR

PN (LQFP, 80)

14mm x 14mm

MSPM0G1519SPNR

MSPM0G3518SPNR

MSPM0G3519SPNR

MSPM0G1518SPMR

PM (LQFP, 64)

12mm x 12mm
MSPM0G1518SPM

MSPM0G1519SPMR

MSPM0G3518SPMR

MSPM0G3519SPMR

MSPM0G1518SPTR

PT (LQFP, 48)

9mm x 9mm

MSPM0G1519SPTR

MSPM0G3518SPTR

MSPM0G3519SPTR

MSPM0G1518SRGZR

RGZ (VQFN, 48)

7mm x 7mm

MSPM0G1519SRGZR

MSPM0G3518SRGZR

MSPM0G3519SRGZR

MSPM0G1518S42YCJR

YCJ (DSBGA, 42)

2.841mm x 2.383mm

MSPM0G1519S42YCJR

MSPM0G3518S42YCJR

MSPM0G3519S42YCJR

MSPM0G1518SRHBR

RHB (VQFN, 32)

5mm x 5mm

MSPM0G1519SRHBR

MSPM0G3518SRHBR

MSPM0G3519SRHBR

(1) For more information, see Section 12.
(2) The package size (length x width) is a nominal value and includes pins, where applicable