SBOS286D December 2003 – March 2022 OPA1632
The OPA1632 does not have thermal shutdown protection. Take care to assure that the maximum junction temperature is not exceeded. Excessive junction temperature can degrade performance or cause permanent damage. For best performance and reliability, assure that the junction temperature does not exceed 125°C.
The thermal characteristics of the device are dictated by the package and the circuit board. Maximum power dissipation for a given package can be calculated using the following formula:
For systems where heat dissipation is more critical, the OPA1632 is offered in an MSOP-8 with PowerPAD. The thermal coefficient for the MSOP PowerPAD (DGN) package is substantially improved over the traditional SO package. Maximum power dissipation levels are depicted in Figure 10-3 for the two packages. The data for the DGN package assume a board layout that follows the PowerPAD layout guidelines.