SBOS286D December   2003  – March 2022 OPA1632

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics: OPA1632D
    6. 6.6 Electrical Characteristics: OPA1632DGN
    7. 6.7 Typical Characteristics: OPA1632D
    8. 6.8 Typical Characteristics: OPA1632DGN
  7. 7 Detailed Description
    1. 7.1 Overview
      1. 7.1.1 Fully-Differential Amplifiers
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Function
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Output Common-Mode Voltage
        1. 8.1.1.1 Resistor Matching
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 PowerPAD Design Considerations
      2. 10.1.2 Power Dissipation and Thermal Considerations
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Third-Party Products Disclaimer
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Export Control Notice
    8. 11.8 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)(2)
MIN MAX UNIT
±VS Supply Voltage ±16.5 V
Supply turn-on/off dV/dT(3) 1.7
V/µs
VI Input Voltage ±VS V
IO Output Current 150 mA
IIN Continuous Input Current 10 mA
VID Differential Input Voltage ±1.5 V
TJ Maximum Junction Temperature 150 °C
Operating Free-Air Temperature Range –40 85 °C
TSTG Storage Temperature Range –65 150 °C
(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute maximum ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If briefly operating outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not sustain damage, but it may not be fully functional. Operating the device in this manner may affect device reliability, functionality, performance, and shorten the device lifetime.
(2) The OPA1632 MSOP-8 package version incorporates a PowerPAD on the underside of the chip. This acts as a heatsink and must be connected to a thermally-dissipative plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction temperature, which can permanently damage the device. See TI technical brief SLMA002 for more information about using the PowerPAD thermally-enhanced package.
(3) Staying below this specification ensures that the edge-triggered ESD absorption devices across the supply pins remain off.