SBOS556D June   2011  – August 2020 OPA171-Q1 , OPA2171-Q1 , OPA4171-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions : OPA171-Q1 and OPA2171-Q1
    2.     Pin Functions : OPA4171-Q1
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information — OPA171-Q1 and OPA2171-Q1
    5. 6.5 Thermal Information — OPA4171-Q1
    6. 6.6 Electrical Characteristics
    7. 6.7 Typical Characteristics
      1. 6.7.1 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Operating Characteristics
      2. 7.3.2 Phase-Reversal Protection
      3. 7.3.3 Capacitive Load and Stability
    4. 7.4 Device Functional Modes
      1. 7.4.1 Common-Mode Voltage Range
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Electrical Overstress
    2. 8.2 Typical Application
      1. 8.2.1 Capacitive Load Drive Solution Using an Isolation Resistor
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Related Links
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision C (December 2015) to Revision D (August 2020)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Changed OPA2171-Q1 V+ pinout table value to correctly reflect pinout imageGo
  • Rewrote Electrical Overstress section to match with TLV171 commercial data sheetGo

Changes from Revision B (December 2014) to Revision C (December 2015)

  • Changed the ESD classification levels for HBM and CDM in the Features list Go
  • Added the 8-pin VSSOP (DGK) package option for the OPA2171-Q1 device Go
  • Clarified the ESD values for each device in the ESD Ratings table Go

Changes from Revision A (September 2012) to Revision B (December 2014)

  • Added the Handling Ratings table, Feature Description section, Device Functional Modes section, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
  • Added the OPA2171-Q1 and OPA4171-Q1 devices to the data sheet Go

Changes from Revision * (June, 2011) to Revision A (September, 2012)

  • Added second bullet to Features: AEC-Q100 Test Guidance With the Following Results: –Device Temperature Grade1: -40°C to 125°C Ambient Operating Temperature Range –Device HBM ESD Classification Level H2 –Device CDM ESD Classification Level C3AGo
  • Updated formatting of Absolute Maximum Ratings table to include VALUE, MIN and MAX; right-aligned values.Go
  • Added classification levels to ESD ratings in Absolute Maximum Ratings table.Go
  • Added row to Absolute Maximum Ratings table: Latch-up per JESD78D with Class 1 value.Go