SBOS516F September   2010  – April 2018 OPA171 , OPA2171 , OPA4171

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      Offset Voltage vs Common-Mode Voltage
      2.      Offset Voltage vs Power Supply
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions: OPA171
    2.     Pin Functions: OPA2171
    3.     Pin Functions: OPA4171
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information: OPA171
    5. 6.5 Thermal Information: OPA2171
    6. 6.6 Thermal Information: OPA4171
    7. 6.7 Electrical Characteristics
    8. 6.8 Typical Characteristics: Table of Graphs
    9. 6.9 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Operating Characteristics
      2. 7.3.2 Common-Mode Voltage Range
      3. 7.3.3 Phase-Reversal Protection
      4. 7.3.4 Capacitive Load and Stability
    4. 7.4 Device Functional Modes
      1. 7.4.1 Common-Mode Voltage Range
  8. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Electrical Overstress
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Capacitive Load and Stability
      3. 8.2.3 Application Curve
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Related Links
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Thermal Information: OPA4171

THERMAL METRIC(1) OPA4171 UNIT
D (SOIC) PW (TSSOP)
14 PINS 14 PINS
RθJA Junction-to-ambient thermal resistance 93.2 106.9 °C/W
RθJC(top) Junction-to-case(top) thermal resistance 51.8 24.4 °C/W
RθJB Junction-to-board thermal resistance 49.4 59.3 °C/W
ψJT Junction-to-top characterization parameter 13.5 0.6 °C/W
ψJB Junction-to-board characterization parameter 42.2 54.3 °C/W
RθJC(bot) Junction-to-case(bottom) thermal resistance N/A N/A °C/W
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.