SBOS830I September   2017  – October 2021 OPA189 , OPA2189 , OPA4189

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information: OPA189
    5. 7.5 Thermal Information: OPA2189
    6. 7.6 Thermal Information: OPA4189
    7. 7.7 Electrical Characteristics
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Operating Characteristics
      2. 8.3.2 Phase-Reversal Protection
      3. 8.3.3 Input Bias Current Clock Feedthrough
      4. 8.3.4 EMI Rejection
      5. 8.3.5 EMIRR +IN Test Configuration
      6. 8.3.6 Electrical Overstress
      7. 8.3.7 MUX-Friendly Inputs
      8. 8.3.8 Noise Performance
      9. 8.3.9 Basic Noise Calculations
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 25-kHz Low-Pass Filter
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
      2. 9.2.2 Discrete INA + Attenuation for ADC With 3.3-V Supply
      3. 9.2.3 Bridge Amplifier
      4. 9.2.4 Low-Side Current Monitor
      5. 9.2.5 Programmable Power Supply
      6. 9.2.6 RTD Amplifier With Linearization
    3. 9.3 System Examples
      1. 9.3.1 24-Bit, Delta-Sigma, Differential Load Cell or Strain Gauge Sensor Signal Conditioning
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
        1. 12.1.1.1 TINA-TI™ Simulation Software (Free Download)
        2. 12.1.1.2 TI Precision Designs
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.3 Feature Description

The OPAx189 series of op amps can be used with single or dual supplies from an operating range of VS = 4.5 V (±2.25 V) up to VS = 36 V (±18 V). These devices do not require symmetrical supplies; they only require a minimum supply voltage of 4.5 V (±2.25 V). For VS less than ±2.5 V, the
common-mode input range does not include midsupply. Supply voltages higher than 40 V can permanently damage the device; see the Absolute Maximum Ratings table for details. Key parameters are given over the specified temperature range, TA = –40°C to +125°C, in the Electrical Characteristics table. Key parameters that vary over the supply voltage, temperature range, or frequency are shown in the Typical Characteristics section.

The OPAx189 is unity-gain stable and free from unexpected output phase reversal. This device uses a proprietary, periodic autocalibration technique to provide low input offset voltage and very low input offset voltage drift over time and temperature. For lowest offset voltage and precision performance, optimize circuit layout and mechanical conditions. Avoid temperature gradients that create thermoelectric (Seebeck) effects in the thermocouple junctions formed from connecting dissimilar conductors. Cancel these thermally-generated potentials by ensuring they are equal on both input pins. Other layout and design considerations include:

• Use low thermoelectric-coefficient conditions (avoid dissimilar metals).

• Thermally isolate components from power supplies or other heat sources.

• Shield operational amplifier and input circuitry from air currents, such as cooling fans.

Follow these guidelines to reduce the likelihood of junctions being at different temperatures, which may cause thermoelectric voltages of 0.1 µV/°C or higher, depending on the materials used. See the Layout Guidelines section for details and a layout example.