SBOS618I December   2013  – May 2018 OPA172 , OPA2172 , OPA4172

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      JFET-Input Low-Noise Amplifier
      2.      Superior THD Performance
  4. Revision History
  5. Device Comparison
    1. 5.1 Device Comparison
    2. 5.2 Device Family Comparison
  6. Pin Configuration and Functions
    1.     Pin Functions: OPA172
    2.     Pin Functions: OPA2172 and OPA4172
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information: OPA172
    5. 7.5 Thermal Information: OPA2172
    6. 7.6 Thermal Information: OPA4172
    7. 7.7 Electrical Characteristics
    8. 7.8 Typical Characteristics: Table of Graphs
    9. 7.9 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 EMI Rejection
      2. 8.3.2 Phase-Reversal Protection
      3. 8.3.3 Capacitive Load and Stability
    4. 8.4 Device Functional Modes
      1. 8.4.1 Common-Mode Voltage Range
      2. 8.4.2 Electrical Overstress
      3. 8.4.3 Overload Recovery
  9. Applications and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Capacitive Load Drive Solution Using an Isolation Resistor
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
      2. 9.2.2 Bidirectional Current Source
      3. 9.2.3 JFET-Input Low-Noise Amplifier
  10. 10Power-Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
        1. 12.1.1.1 TINA-TI (Free Software Download)
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Related Links
    4. 12.4 Community Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Typical Characteristics: Table of Graphs

Table 1. List of Typical Characteristics

DESCRIPTION FIGURE
Offset Voltage Production Distribution Figure 1
Offset Voltage Drift Distribution Figure 2
Offset Voltage vs Temperature (VS = ±18 V) Figure 3
Offset Voltage vs Common-Mode Voltage (VS = ±18 V) Figure 4
Offset Voltage vs Common-Mode Voltage (Upper Stage) Figure 5
Offset Voltage vs Power Supply Figure 6
IB vs Common-Mode Voltage Figure 7
Input Bias Current vs Temperature Figure 8
Output Voltage Swing vs Output Current (Maximum Supply) Figure 9
CMRR and PSRR vs Frequency (Referred-to Input) Figure 10
CMRR vs Temperature Figure 11
PSRR vs Temperature Figure 12
0.1-Hz to 10-Hz Noise Figure 13
Input Voltage Noise Spectral Density vs Frequency Figure 14
THD+N Ratio vs Frequency Figure 15
THD+N vs Output Amplitude Figure 16
Quiescent Current vs Temperature Figure 17
Quiescent Current vs Supply Voltage Figure 18
Open-Loop Gain and Phase vs Frequency Figure 19
Closed-Loop Gain vs Frequency Figure 20
Open-Loop Gain vs Temperature Figure 21
Open-Loop Output Impedance vs Frequency Figure 22
Small-Signal Overshoot vs Capacitive Load (100-mV Output Step) Figure 23, Figure 24
Positive Overload Recovery Figure 25, Figure 26
Negative Overload Recovery Figure 27, Figure 28
Small-Signal Step Response (10 mV) Figure 29, Figure 30
Small-Signal Step Response (100 mV) Figure 31, Figure 32
Large-Signal Step Response (1 V) Figure 33, Figure 34
Large-Signal Settling Time (10-V Positive Step) Figure 35
Large-Signal Settling Time (10-V Negative Step) Figure 36
No Phase Reversal Figure 37
Short-Circuit Current vs Temperature Figure 38
Maximum Output Voltage vs Frequency Figure 39
EMIRR vs Frequency Figure 40
Channel Separation vs Frequency Figure 41