SBOS259F September   2002  – June 2018 OPA2363 , OPA2364 , OPA363 , OPA364 , OPA4364

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Single-Supply Microphone Preamplifier
  4. 4 Revision History
  5. 5 Device Comparison Table
    1. 5.1 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions: OPA363
    2.     Pin Functions: OPA2363
    3.     Pin Functions: OPA364
    4.     Pin Functions: OPA2364
    5.     Pin Functions: OPA4364
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information: OPA363
    5. 7.5  Thermal Information: OPA364
    6. 7.6  Thermal Information: OPA2363
    7. 7.7  Thermal Information: OPA2364
    8. 7.8  Thermal Information: OPA4364
    9. 7.9  Electrical Characteristics
    10. 7.10 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Rail-to-Rail Input
      2. 8.3.2 Operating Voltage
      3. 8.3.3 Capacitive Load
      4. 8.3.4 Input and ESD Protection
    4. 8.4 Device Functional Modes
      1. 8.4.1 Enable Function
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Achieving Output Swing to the Op Amp Negative Rail
      2. 9.1.2 Directly Driving the ADS8324 and the MSP430
      3. 9.1.3 Audio Applications
      4. 9.1.4 Active Filtering
    2. 9.2 Typical Application
      1. 9.2.1 Single-Supply Electret Microphone Preamplifier
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
        1. 12.1.1.1 TINA-TI™ (Free Software Download)
        2. 12.1.1.2 DIP Adapter EVM
        3. 12.1.1.3 Universal Op Amp EVM
        4. 12.1.1.4 TI Precision Designs
        5. 12.1.1.5 WEBENCH Filter Designer
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Related Links
    4. 12.4 Receiving Notification of Documentation Updates
    5. 12.5 Community Resource
    6. 12.6 Trademarks
    7. 12.7 Electrostatic Discharge Caution
    8. 12.8 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from E Revision (January 2018) to F Revision

  • Changed OPA363 SOT-23 (5) to SOT-23 (6) in Device Information table Go
  • Added OPA363 SOIC (8) package to Device Information table Go
  • Changed OPA364 SOT-23 (6) to SOT-23 (5) in Device Information table Go
  • Deleted OPA2364 VSSOP (10) and UQFN (16) packages from Device Information tableGo
  • Deleted OPA2363 SOIC (8) and VSSOP (8) packages from Device Information tableGo

Changes from D Revision (September 2016) to E Revision

  • Changed OPA36x and OPA236x part numbers to OPA364 and OPA2363 in Device Information tableGo
  • Added OPA2364 device to Device Information table Go
  • Corrected formatting of pinout drawings in Pin Configuration and Functions sectionGo
  • Corrected formatting of pinout tables in Pin Configuration and Functions sectionGo
  • Added a minimum value of 0 V to supply voltage parameter in Absolute Maximum Ratings table Go
  • Added "([V+] – [V–])" to supply voltage parameter in Absolute Maximum Ratings table Go
  • Deleted operating temperature range from Absolute Maximum Ratings tableGo
  • Added the word "temperature" to junction and storage temperature ranges in Absolute Maximum Ratings tableGo
  • Added "([V+] – [V–])" to supply voltage parameter in Recommended Operating Conditions table Go
  • Changed output voltage swing parameter units from V to mVGo
  • Deleted temperature range section of Electrical Characteristics tableGo
  • Changed PSRR test condition from VCM = 0 to VCM = (V–) in Electrical Characteristics tableGo
  • Deleted Buffered Reference Voltage subsection in Application Information section Go
  • Changed Figure 33Go
  • Added Figure 34Go
  • Changed "IC" to "device" throughout data sheetGo

Changes from C Revision (May 2013) to D Revision

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
  • Deleted Package and Ordering Information section, see POA at the end of the datasheet.Go

Changes from B Revision (February 2003) to C Revision

  • Converted data sheet to current formatGo
  • Added RSV package (UQFN-16) to data sheetGo
  • Added text to last bullet of Layout Guidelines sectionGo