SBOSAA5B April   2022  – September 2022 OPA2675

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Family Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics: Full Bias and Offline Mode VS = ±6 V
    6. 7.6  Electrical Characteristics: 75% Bias Mode VS = ±6 V
    7. 7.7  Electrical Characteristics: 50% Bias Mode VS = ±6 V
    8. 7.8  Electrical Characteristics: DIfferential Output  VS = 12 V
    9. 7.9  Electrical Characteristics: VS = 5 V
    10. 7.10 Typical Characteristics: VS = ±6 V, Full Bias
    11. 7.11 Typical Characteristics: VS = ±6 V Differential, Full Bias
    12. 7.12 Typical Characteristics: VS = ±6 V, 75% Bias
    13. 7.13 Typical Characteristics: VS = ±6 V, 50% Bias
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Operating Suggestions
        1. 8.3.1.1 Setting Resistor Values to Optimize Bandwidth
        2. 8.3.1.2 Output Current and Voltage
        3. 8.3.1.3 Driving Capacitive Loads
        4. 8.3.1.4 Line Driver Headroom Model
        5. 8.3.1.5 Noise Performance
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 High-Speed Active Filters
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Thermal Analysis
    2. 10.2 Input and ESD Protection
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Thermal Information

THERMAL METRIC(1) OPA2675 UNIT
RGV (VQFN)
16 PINS
RθJA Junction-to-ambient thermal resistance 43 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 43 °C/W
RθJB Junction-to-board thermal resistance 18 °C/W
ΨJT Junction-to-top characterization parameter 1.1 °C/W
YJB Junction-to-board characterization parameter 18 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 2.5 °C/W
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.