SBOS973A June   2019  – September 2019 OPA2834

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      1-kHz FFT Plot (VOUT = 1 VRMS, RL = 100 kΩ, G = 1)
      2.      Low-Side, Current-Shunt Monitoring
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics: 3V to 5V
    6. 7.6 Typical Characteristics: Vs = 5 V
    7. 7.7 Typical Characteristics: VS = 3.0 V
    8. 7.8 Typical Characteristics: ±2.5-V to ±1.5-V Split Supply
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
      1. 8.3.1 Input Common-Mode Voltage Range
      2. 8.3.2 Output Voltage Range
      3. 8.3.3 Low-Power Applications and the Effects of Resistor Values on Bandwidth
      4. 8.3.4 Driving Capacitive Loads
    4. 8.4 Device Functional Modes
      1. 8.4.1 Split-Supply Operation (±1.35 V to ±2.7 V)
      2. 8.4.2 Single-Supply Operation (2.7 V to 5.4 V)
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Noninverting Amplifier
      2. 9.1.2 Inverting Amplifier
    2. 9.2 Typical Applications
      1. 9.2.1 Low-Side Current Sensing
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
      2. 9.2.2 Field Transmitter Sensor Interface
      3. 9.2.3 Ultrasonic Flow Meters
      4. 9.2.4 Microphone Pre-Amplifier
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Examples
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4 Thermal Information

THERMAL METRIC(1) OPA2834 UNIT
DGK (VSSOP)
8 PINS
RθJA Junction-to-ambient thermal resistance 192.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 79.3 °C/W
RθJB Junction-to-board thermal resistance 114.3 °C/W
ΨJT Junction-to-top characterization parameter 15.7 °C/W
YJB Junction-to-board characterization parameter 112.6 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.