SBOS841A November   2016  – January 2017 OPA2316-Q1 , OPA316-Q1 , OPA4316-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information: OPA316-Q1
    5. 6.5 Thermal Information: OPA2316-Q1
    6. 6.6 Thermal Information: OPA4316-Q1
    7. 6.7 Electrical Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Operating Voltage
      2. 7.3.2 Rail-to-Rail Input
      3. 7.3.3 Input and ESD Protection
      4. 7.3.4 Common-Mode Rejection Ratio (CMRR)
      5. 7.3.5 EMI Susceptibility and Input Filtering
      6. 7.3.6 Rail-to-Rail Output
      7. 7.3.7 Capacitive Load and Stability
      8. 7.3.8 Overload Recovery
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 General Configurations
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Amplifier Selection
        2. 8.2.2.2 Passive Component Selection
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Related Links
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from * Revision (November 2016) to A Revision

  • Changed CDM classification reduced from C6 Go
  • Deleted OPA2316S-Q1 package and body size information from Device Information table Go
  • Deleted SC70 (5) (OPA316-Q1), DFN (8), MSOP (8), SOIC (8) (OPA2316-Q1), and SOIC (14) packages (OPA4316-Q1) from the Device Information table, Thermal Information tables, and pinout diagramsGo
  • Deleted OPA2316S-Q1 pin diagram and Pin Functions table in Pin Configurations and Functions section Go
  • Deleted D (SOIC) package from OPA4316-Q1 pin diagram in Pin Configurations and Functions section Go
  • Changed CDM rating from ±1500 V to ±750 VGo
  • Deleted OPA2316S-Q1 device thermal information in the Thermal Information table Go
  • Added thermal information for OPA4316-Q1 deviceGo
  • Deleted the literature numbers in parentheses from the format of TI document references in the Documentation Support section Go