SBOSA61B April   2021  – December 2021 OPA3S2859-EP

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revison History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Programmable Gain
      2. 8.3.2 Slew Rate
      3. 8.3.3 Input and ESD Protection
    4. 8.4 Device Functional Modes
      1. 8.4.1 Split-Supply and Single-Supply Operation
      2. 8.4.2 Power-Down Mode
      3. 8.4.3 Gain Select Mode (SEL)
      4. 8.4.4 Latch Mode
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Examples
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Features

  • Gain bandwidth product: 900 MHz
  • Internal switches for programmable gain
  • High impedance FET inputs
  • Input voltage noise: 2.2 nV/√Hz
  • Slew rate: 350 V/μs
  • Supply voltage range: 3.3 V to 5.25 V
  • Quiescent current: 22 mA/channel
  • Power down mode IQ: 75 μA
  • Temperature range: -55 °C to 125 °C
  • Supports defense, aerospace, and medical applications
    • Controlled baseline
    • One assembly and test site
    • One fabrication site
    • Extended product life cycle
    • Extended product-change notification
    • Product traceability