SBOS834B December   2016  – November 2017 OPA170-Q1 , OPA2170-Q1 , OPA4170-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information: OPA170-Q1
    5. 6.5 Thermal Information: OPA2170-Q1
    6. 6.6 Thermal Information: OPA4170-Q1
    7. 6.7 Electrical Characteristics
    8. 6.8 Typical Characteristics: Table of Graphs
    9. 6.9 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Operating Characteristics
      2. 7.3.2 Phase-Reversal Protection
      3. 7.3.3 Electrical Overstress
      4. 7.3.4 Capacitive Load and Stability
    4. 7.4 Device Functional Modes
      1. 7.4.1 Common-Mode Voltage Range
      2. 7.4.2 Overload Recovery
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 TINA-TI™ (Free Software Download)
        2. 11.1.1.2 DIP Adapter EVM
        3. 11.1.1.3 Universal Operational Amplifier EVM
        4. 11.1.1.4 TI Precision Designs
        5. 11.1.1.5 WEBENCH Filter Designer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Related Links
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from A Revision (March 2017) to B Revision

  • Deleted 8-pin SOIC, 5-pin SOT, 8-pin VSSOP, and 14-pin SOIC packages from Device Information tableGo
  • Changed front-page graphic Go
  • Deleted OPA170-Q1 D (SOIC) and DRL (SOT) pinout drawings and pinout table informationGo
  • Deleted OPA2170-Q1 D (SOIC) and DCU (VSSOP Micro size packagesGo
  • Deleted OPA170-Q1 D (SOIC) pinout drawingGo
  • Deleted D (SOIC) and DRL (SOT) thermal information from OPA170-Q1 Thermal Information table Go
  • Deleted D (SOIC) and DCU (VSSOP) thermal information from OPA2170-Q1 Thermal Information table Go
  • Deleted D (SOIC) thermal information from OPA4170-Q1 Thermal Information table Go
  • Changed values in Figure 38 from 250 Ω to 2.5 kΩ Go

Changes from * Revision (December 2016) to A Revision

  • Deleted last sentence of first para of Description Go
  • Deleted static literature number in Thermal Information: OPA170-Q1 table note Go
  • Separated the IB and IOS test conditions for the OPA4170 in Electrical Characteristics tableGo
  • Added additional text to Figure 8 title Go
  • Changed "many specifications apply from –40°C to +125°C" to "many specifications apply from –40°C to +85°C" to correct typoGo