SBOS918A March   2018  – January 2021 OPA197-Q1 , OPA2197-Q1 , OPA4197-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information: OPA197-Q1
    5. 6.5 Thermal Information: OPA2197-Q1
    6. 6.6 Thermal Information: OPA4197-Q1
    7. 6.7 Electrical Characteristics: VS = ±4 V to ±18 V (VS = 8 V to 36 V)
    8. 6.8 Electrical Characteristics: VS = ±2.25 V to ±4 V (VS = 4.5 V to 8 V)
    9. 6.9 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Input Protection Circuitry
      2. 7.3.2 EMI Rejection
      3. 7.3.3 Phase Reversal Protection
      4. 7.3.4 Thermal Protection
      5. 7.3.5 Capacitive Load and Stability
      6. 7.3.6 Common-Mode Voltage Range
      7. 7.3.7 Electrical Overstress
      8. 7.3.8 Overload Recovery
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 16-Bit Precision Multiplexed Data-Acquisition System
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Slew-Rate Limit for Input Protection
      3. 8.2.3 Precision Reference Buffer
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 TINA-TI™ Simulation Software (Free Download)
        2. 11.1.1.2 TI Precision Designs
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information: OPA197-Q1

THERMAL METRIC(1) OPA197-Q1 UNIT
DGK (VSSOP)
8 PINS
RθJA  Junction-to-ambient thermal resistance 180.4 °C/W
RθJC(top) Junction-to-case(top) thermal resistance 67.9 °C/W
RθJB Junction-to-board thermal resistance 102.1 °C/W
ψJT Junction-to-top characterization parameter 10.4 °C/W
ψJB Junction-to-board characterization parameter 100.3 °C/W
RθJC(bot) Junction-to-case(bottom) thermal resistance N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.