SBOS350B December   2006  – December 2024 OPA4830

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Related Products
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics VS = ±5V
    6. 6.6  Electrical Characteristics VS = 5V
    7. 6.7  Electrical Characteristics VS = 3V
    8. 6.8  Typical Characteristics: VS = ±5V
    9. 6.9  Typical Characteristics: VS = ±5V, Differential Configuration
    10. 6.10 Typical Characteristics: VS = 5V
    11. 6.11 Typical Characteristics: VS = 5V, Differential Configuration
    12. 6.12 Typical Characteristics: VS = 3V
    13. 6.13 Typical Characteristics: VS = 3V, Differential Configuration
  8. 7 Parameter Measurement Information
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1  Wideband Voltage-Feedback Operation
      2. 8.1.2  DC Level-Shifting
      3. 8.1.3  AC-Coupled Output Video Line Driver
      4. 8.1.4  Noninverting Amplifier With Reduced Peaking
      5. 8.1.5  Single-Supply Active Filter
      6. 8.1.6  Differential Interface Applications
      7. 8.1.7  DC-Coupled Single-to-Differential Conversion
      8. 8.1.8  Low-Power, Differential I/O, 4th-Order Active Filter
      9. 8.1.9  Dual-Channel, Differential ADC Driver
      10. 8.1.10 Video Line Driving
      11. 8.1.11 4-Channel DAC Transimpedance Amplifier
      12. 8.1.12 Operating Suggestions: Optimizing Resistor Values
      13. 8.1.13 Bandwidth vs Gain: Noninverting Operation
      14. 8.1.14 Inverting Amplifier Operation
      15. 8.1.15 Output Current and Voltages
      16. 8.1.16 Driving Capacitive Loads
      17. 8.1.17 Distortion Performance
      18. 8.1.18 Noise Performance
      19. 8.1.19 DC Accuracy and Offset Control
    2. 8.2 Power Supply Recommendations
      1. 8.2.1 Thermal Analysis
    3. 8.3 Layout
      1. 8.3.1 Layout Guidelines
        1. 8.3.1.1 Input and ESD Protection
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Design-In Tools
        1. 9.1.1.1 Demonstration Fixtures
        2. 9.1.1.2 Macromodels and Applications Support
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • PW|14
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) OPA4830 UNIT
PW (TSSOP)
14 PINS
RθJA Junction-to-ambient thermal resistance 109.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 36.6 °C/W
RθJB Junction-to-board thermal resistance 66.0 °C/W
ψJT Junction-to-top characterization parameter 1.6 °C/W
ψJB Junction-to-board characterization parameter 65.2 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.