SBOSA10F June   2021  – March 2024 OPA2992 , OPA4992 , OPA992

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information for Single Channel
    5. 5.5 Thermal Information for Dual Channel
    6. 5.6 Thermal Information for Quad Channel
    7. 5.7 Electrical Characteristics
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Input Protection Circuitry
      2. 6.3.2  EMI Rejection
      3. 6.3.3  Thermal Protection
      4. 6.3.4  Capacitive Load and Stability
      5. 6.3.5  Common-Mode Voltage Range
      6. 6.3.6  Phase Reversal Protection
      7. 6.3.7  Electrical Overstress
      8. 6.3.8  Overload Recovery
      9. 6.3.9  Typical Specifications and Distributions
      10. 6.3.10 Packages With an Exposed Thermal Pad
      11. 6.3.11 Shutdown
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Low-Side Current Measurement
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curve
      2. 7.2.2 High Voltage Buffered Multiplexer
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
        1. 8.1.1.1 TINA-TI (Free Software Download)
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.7 Electrical Characteristics

For VS = (V+) – (V–) = 2.7 V to 40 V (±1.35 V to ±20 V) at TA = 25°C, RL = 10 kΩ connected to VS / 2, VCM = VS / 2, and VOUT = VS / 2, unless otherwise noted.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
OFFSET VOLTAGE
VOS Input offset voltage VCM = V– ±0.21 ±1 mV
TA = –40°C to 125°C ±1.2
dVOS/dT Input offset voltage drift VCM = V– TA = –40°C to 125°C ±0.25 µV/℃
PSRR Input offset voltage versus power supply  OPA992, OPA2992, VCM = V–, VS = 5 V to 40 V TA = –40°C to 125°C ±0.2 ±1.3 μV/V
OPA2992SIRUGR, VCM = V–, VS = 5 V to 40 V ±0.2 ±3.7
OPA4992, VCM = V–, VS = 5 V to 40 V ±0.4 ±1.8
OPA992, OPA2992, OPA4992, VCM = V–, VS = 2.7 V to 40 V(1) ±0.8 ±7
DC channel separation 0.4 µV/V
INPUT BIAS CURRENT
IB Input bias current ±10 pA
IOS Input offset current ±10 pA
NOISE
EN Input voltage noise f = 0.1 Hz to 10 Hz   2.77 μVPP
  0.49   µVRMS
eN Input voltage noise density f = 1 kHz 7   nV/√Hz
f = 10 kHz   4.4  
iN Input current noise density f = 1 kHz   60   fA/√Hz
INPUT VOLTAGE RANGE
VCM Common-mode voltage range (V–) (V+) V
CMRR Common-mode rejection ratio VS = 40 V, V– < VCM < (V+) – 2 V (PMOS pair) TA = –40°C to 125°C 100 115 dB
VS = 5 V, V– < VCM < (V+) – 2 V (PMOS pair)(1) 75 98
VS = 2.7 V, V– < VCM < (V+) – 2 V (PMOS pair) 90
VS = 2.7 – 40 V, (V+) – 1 V < VCM < V+ (NMOS pair) 79
(V+) – 2 V < VCM < (V+) – 1 V See Offset Voltage vs Common-Mode Voltage (Transition Region)
INPUT IMPEDANCE
ZID Differential 100 || 9 MΩ || pF
ZICM Common-mode 6 || 1 TΩ || pF
OPEN-LOOP GAIN
AOL Open-loop voltage gain VS = 40 V, VCM = VS / 2,
(V–) + 0.1 V < VO < (V+) –  0.1 V		 120 142 dB
VS = 40 V, VCM = VS / 2,
(V–) + 0.12 V < VO < (V+) –  0.12 V		 TA = –40°C to 125°C 142
VS = 5 V, VCM = VS / 2,
(V–) + 0.1 V < VO < (V+) –  0.1 V(1)		 104 125
TA = –40°C to 125°C 125
VS = 2.7 V, VCM = VS / 2,
(V–) + 0.1 V < VO < (V+) –  0.1 V(1)		 90 105
TA = –40°C to 125°C 105
FREQUENCY RESPONSE
GBW Gain-bandwidth product 10.6 MHz
SR Slew rate VS = 40 V, G = +1, VSTEP = 10 V, CL = 20 pF(5) 32 V/μs
tS Settling time To 0.1%, VS = 40 V, VSTEP = 10 V, G = +1, CL = 20 pF 0.65 μs
To 0.1%, VS = 40 V, VSTEP = 2 V, G = +1, CL = 20 pF 0.3
To 0.01%, VS = 40 V, VSTEP = 10 V, G = +1, CL = 20 pF 0.86
To 0.01%, VS = 40 V, VSTEP = 2 V, G = +1, CL = 20 pF 0.44
Phase margin G = +1, RL = 10 kΩ, CL = 20 pF 64 °
Overload recovery time VIN  × gain > VS 170 ns
THD+N Total harmonic distortion + noise VS = 40 V, VO = 3 VRMS, G = 1, f = 1 kHz, RL = 10 kΩ 0.00005%
126 dB
VS = 10 V, VO = 3 VRMS, G = 1, f = 1 kHz, RL = 128 Ω 0.0032%
90 dB
VS = 10 V, VO = 0.4 VRMS, G = 1, f = 1 kHz, RL = 32 Ω 0.00032%
110 dB
OUTPUT
  Voltage output swing from rail Positive and negative
rail headroom		 VS = 40 V, RL = no load   7 mV
VS = 40 V, RL = 10 kΩ   48 60
VS = 40 V, RL = 2 kΩ   220 300
VS = 2.7 V, RL = no load   0.5
VS = 2.7 V, RL = 10 kΩ   5 20
VS = 2.7 V, RL = 2 kΩ   20 50
ISC Short-circuit current ±65(3) mA
CLOAD Capacitive load drive See Phase Margin vs Capacitive Load pF
ZO Open-loop output impedance IO = 0 A See Open-Loop Output Impedance vs Frequency Ω
POWER SUPPLY
IQ Quiescent current per amplifier OPA2992, OPA4992, IO = 0 A 2.4 2.8 mA
TA = –40°C to 125°C 2.84
OPA992, IO = 0 A 2.48 2.92
TA = –40°C to 125°C 2.98
SHUTDOWN
IQSD Quiescent current per amplifier VS = 2.7 V to 40 V, all amplifiers disabled, SHDN = V– + 2 V 40 45 µA
ZSHDN Output impedance during shutdown VS = 2.7 V to 40 V, amplifier disabled 10 || 2 GΩ || pF
VIH Logic high threshold voltage (amplifier disabled) For valid input high, the SHDN pin voltage should be greater than the maximum threshold but less than or equal to V+ or (V–) + 20 V, whichever is less
(V–) + 1.1 V

 V
VIL Logic low threshold voltage (amplifier enabled) For valid input low, the SHDN pin voltage should be less than the minimum threshold but greater than or equal to V–
(V–) + 0.2 V

 V
tON Amplifier enable time (from shutdown) (2) VS = ±20 V, G = +1, VCM = VS / 2, RL = 10 kΩ connected to V– 5 µs
tOFF Amplifier disable time (2) VS = ±20 V, G = +1, VCM = VS / 2, RL = 10 kΩ connected to V– 3 µs
SHDN pin input bias current (per pin) VS = 2.7 V to 40 V, (V–) + 20 V (4) ≥ SHDN ≥ (V–) + 0.9 V 500 nA
VS = 2.7 V to 40 V, (V–) ≤ SHDN ≤ (V–) + 0.7 V 400
(1) Specified by characterization only.
(2) Disable time (tOFF) and enable time (tON) are defined as the time interval between the 50% point of the signal applied to the SHDN pin and the point at which the output voltage reaches 10% (disable) or 90% (enable) of its final value.
(3) At high supply voltage, placing the OPAx992 in a sudden short to mid-supply or ground will lead to rapid thermal shutdown.  Output current greater than ISC can be achieved if rapid thermal shutdown is avoided as per Output Voltage Swing vs Output Current.
(4) SHDN pin should not exceed V+ or (V-) + 20 V, whichever is less.
(5) See Slew Rate vs Input Step Voltage for more information.