SBOS659B January   2022  – August 2022 OPA593


  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Current Limit
      2. 7.3.2 Overcurrent Flag
      3. 7.3.3 Overtemperature Flag
      4. 7.3.4 Output Enable and Disable
      5. 7.3.5 Mux-Friendly Inputs
    4. 7.4 Device Functional Modes
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  9. Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
        1. PSpice® for TI
        2. TINA-TI™ Simulation Software (Free Download)
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Layout Guidelines

During the surface-mount solder operation (when the leads are being soldered), the thermal pad must be soldered to a copper area underneath the package. Through the use of thermal paths within this copper area, heat is conducted away from the package into either a ground plane or other heat-dissipating device. Always solder the thermal pad to the PCB, even with applications that have low power dissipation. Follow these steps to attach the device to the PCB:

  1. Connect the thermal pad to the most negative supply voltage on the device, V–.
  2. Prepare the PCB with a top-side etch pattern. There must be etching for the leads, as well as etching for the thermal pad.
  3. Thermal vias improve heat dissipation, but are not required. The thermal pad can connect to the PCB using an area equal to the pad size with no vias, but must be externally connected to V–.
  4. Place recommended holes in the area of the thermal pad. Recommended thermal land size and thermal via patterns for the SON-12 DNT package are shown in the thermal land pattern mechanical drawing appended at the end of this document. Keep the holes small, so that solder wicking through the holes is not a problem during reflow. Use a 0.2-mm size via with a minimum of five connected directly below the thermal pad.
  5. Additional vias can be placed anywhere along the thermal plane outside of the thermal pad area. These vias help dissipate the heat generated by the OPA593 device. These additional vias can be larger than the vias directly under the thermal pad because the additional vias are not in the thermal pad area to be soldered; thus, wicking is not a problem.
  6. Connect all holes to the internal power plane of the correct voltage potential, V–.
  7. When connecting these holes to the plane, do not use the typical web or spoke via connection methodology. Web connections have a high thermal resistance connection that is useful for slowing the heat transfer during soldering operations, making the soldering of vias that have plane connections easier. In this application, however, low thermal resistance is desired for the most efficient heat transfer. Therefore, the holes under the OPA593 WSON package must make the connections to the internal plane with a complete connection around the entire circumference of the plated-through hole.
  8. The top-side solder mask must leave the pins of the package and the thermal pad area exposed. The bottom-side solder mask must cover the holes of the thermal pad area. This masking prevents solder from being pulled away from the thermal pad area during the reflow process.
  9. Apply solder paste to the exposed thermal pad area and all of the device pins.
  10. With these preparatory steps in place, simply place the device in position, and run through the solder reflow operation as with any standard surface-mount component.