SBOS659B January   2022  – August 2022 OPA593

ADVANCE INFORMATION  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Current Limit
      2. 7.3.2 Overcurrent Flag
      3. 7.3.3 Overtemperature Flag
      4. 7.3.4 Output Enable and Disable
      5. 7.3.5 Mux-Friendly Inputs
    4. 7.4 Device Functional Modes
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  9. Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
        1. 9.1.1.1 PSpice® for TI
        2. 9.1.1.2 TINA-TI™ Simulation Software (Free Download)
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Thermal Information

THERMAL METRIC(1) OPA593 UNIT
DNT (WSON)
12 PINS
RθJA Junction-to-ambient thermal resistance 40.8 ℃/W
RθJC(top) Junction-to-case (top) thermal resistance 30.2 ℃/W
RθJB Junction-to-board thermal resistance 17.8 ℃/W
ψJT Junction-to-top characterization parameter 0.3 ℃/W
ψJB Junction-to-board characterization parameter 17.7 ℃/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 4.3 ℃/W
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.