SBOS263H October   2002  – December 2024 OPA830

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configurations
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics for D Package VS = ±5V
    6. 6.6  Electrical Characteristics for D Package VS = 5V
    7. 6.7  Electrical Characteristics for D Package VS = 3V
    8. 6.8  Electrical Characteristics for DBV Package VS = ±5V
    9. 6.9  Electrical Characteristics for DBV Package VS = 5V
    10. 6.10 Electrical Characteristics for DBV Package VS = 3V
    11. 6.11 Typical Characteristics: VS = ±5V
    12. 6.12 Typical Characteristics: VS = ±5V, Differential Configuration
    13. 6.13 Typical Characteristics: VS = 5V
    14. 6.14 Typical Characteristics: VS = 5V, Differential Configuration
    15. 6.15 Typical Characteristics: VS = 3V
    16. 6.16 Typical Characteristics: VS = 3V, Differential Configuration
  8. 7 Parameter Measurement Information
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1  Wideband Voltage-Feedback Operation
      2. 8.1.2  DC Level-Shifting
      3. 8.1.3  Optimizing Resistor Values
      4. 8.1.4  Bandwidth Versus Gain: Noninverting Operation
      5. 8.1.5  Inverting Amplifier Operation
      6. 8.1.6  Output Current and Voltages
      7. 8.1.7  Driving Capacitive Loads
      8. 8.1.8  Distortion Performance
      9. 8.1.9  Noise Performance
      10. 8.1.10 DC Accuracy and Offset Control
      11. 8.1.11 Thermal Analysis
    2. 8.2 Typical Applications
      1. 8.2.1 Single-Supply ADC Interface
      2. 8.2.2 AC-Coupled Output Video Line Driver
      3. 8.2.3 Noninverting Amplifier With Reduced Peaking
      4. 8.2.4 Single-Supply Active Filter
    3. 8.3 Layout
      1. 8.3.1 Layout Guidelines
        1. 8.3.1.1 Input and ESD Protection
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
        1. 9.1.1.1 Demonstration Boards
        2. 9.1.1.2 Macromodel and Applications Support
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • DBV|5
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) OPA830 UNIT
D (SOIC) DBV (SOT-23)
8 PINS 5 PINS
RθJA Junction-to-ambient thermal resistance 125 186.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance
N/A

 84.0 °C/W
RθJB Junction-to-board thermal resistance
N/A

 53.1 °C/W
ψJT Junction-to-top characterization parameter
N/A

 21.0 °C/W
ψJB Junction-to-board characterization parameter
N/A

 52.7 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance
N/A

 N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.