SBOS681C July 2014 – November 2017 OPT3001
The OPT3001 has been qualified for three soldering reflow operations per JEDEC JSTD-020.
Note that excessive heat may discolor the device and affect optical performance.
See application report SLUA271, QFN/SON PCB Attachment, for details on soldering thermal profile and other information. If the OPT3001 must be removed from a PCB, discard the device and do not reattach.
As with most optical devices, handle the OPT3001 with special care to ensure optical surfaces stay clean and free from damage. See the Do's and Don'ts section for more detailed recommendations. For best optical performance, solder flux and any other possible debris must be cleaned after soldering processes.