SBOS993A December   2021  – December 2022 OPT4001

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Spectral Matching to Human Eye
      2. 8.3.2 Automatic Full-Scale Range Setting
      3. 8.3.3 Output Register CRC and Counter
        1. 8.3.3.1 Output Sample Counter
        2. 8.3.3.2 Output CRC
      4. 8.3.4 Output Register FIFO
      5. 8.3.5 Threshold Detection
    4. 8.4 Device Functional Modes
      1. 8.4.1 Modes of Operation
      2. 8.4.2 Interrupt Modes of Operation
      3. 8.4.3 Light Range Selection
      4. 8.4.4 Selecting Conversion Time
      5. 8.4.5 Light Measurement in Lux
      6. 8.4.6 Light Resolution
    5. 8.5 Programming
      1. 8.5.1 I2C Bus Overview
        1. 8.5.1.1 Serial Bus Address
        2. 8.5.1.2 Serial Interface
      2. 8.5.2 Writing and Reading
        1. 8.5.2.1 High-Speed I2C Mode
        2. 8.5.2.2 Burst Read Mode
        3. 8.5.2.3 General-Call Reset Command
        4. 8.5.2.4 SMBus Alert Response
    6. 8.6 Register Maps
      1. 8.6.1 ALL Register Map
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Electrical Interface
        1. 9.2.1.1 Design Requirements
          1. 9.2.1.1.1 Optical Interface
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Optomechanical Design (PicoStar Variant)
          2. 9.2.1.2.2 Optomechanical Design (SOT-5X3 Variant)
        3. 9.2.1.3 Application Curves (PicoStar Variant)
    3. 9.3 Do's and Don'ts
    4. 9.4 Power Supply Recommendations
    5. 9.5 Layout
      1. 9.5.1 Layout Guidelines
      2. 9.5.2 Layout Example
        1. 9.5.2.1 Soldering and Handling Recommendations (SOT-5X3 Variant)
        2. 9.5.2.2 Soldering and Handling Recommendations (PicoStar Variant)
          1. 9.5.2.2.1 Solder Paste
          2. 9.5.2.2.2 Package Placement
          3. 9.5.2.2.3 Reflow Profile
          4. 9.5.2.2.4 Special Flexible Printed-Circuit Board (FPCB) Recommendations
          5. 9.5.2.2.5 Rework Process
  10. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information
9.5.2.2.4 Special Flexible Printed-Circuit Board (FPCB) Recommendations

Special flexible printed-circuit board (FPCB) design recommendations include:

  • Fabricate per IPC-6013.
  • Use material of flexible copper clad per IPC 4204/11 (Define polyimide and copper thickness per product application).
  • Finish: All exposed copper are electroless Ni immersion gold (ENIG) per IPC 4556.
  • Solder mask per IPC SM840.
  • Use a laser to create the cutout for light sensing for better accuracy, and to avoid affecting the soldering pad dimension. Other options, such as punched cutouts, are possible. See the Section 9.2.1.2.1 for further discussion ranging from the implications of the device to cutout region size and alignment. The full design must be considered, including the tolerances.

To assist the handling of the very thin flexible circuit, design and fabricate a fixture to hold the flexible circuit through the paste-printing, pick-and-place, and reflow processes. Contact the factory for examples of such fixtures.