SBAS704B June   2015  – October 2015 OPT8241

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Optical Characteristics
    9. 6.9 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Output Block
        1. 7.3.1.1 Serializer and LVDS Output Interface
        2. 7.3.1.2 Parallel CMOS Output Interface
      2. 7.3.2 Temperature Sensor
    4. 7.4 Device Functional Modes
    5. 7.5 Programming
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Presence Detection for Industrial Safety
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Frequencies of Operation
          2. 8.2.1.2.2 Number of Sub-Frames and Quads
          3. 8.2.1.2.3 Field of View (FoV)
          4. 8.2.1.2.4 Lens
          5. 8.2.1.2.5 Integration Duty Cycle
          6. 8.2.1.2.6 Design Summary
        3. 8.2.1.3 Application Curve
      2. 8.2.2 People Counting and Locating
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 Frequencies of Operation
          2. 8.2.2.2.2 Number of Sub-Frames and Quads
          3. 8.2.2.2.3 Field of View (FoV)
          4. 8.2.2.2.4 Lens
          5. 8.2.2.2.5 Integration Duty Cycle
          6. 8.2.2.2.6 Design Summary
        3. 8.2.2.3 Application Curve
      3. 8.2.3 People Locating and Identification
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Detailed Design Procedure
          1. 8.2.3.2.1 Frequencies of Operation
          2. 8.2.3.2.2 Number of Sub-Frames and Quads
          3. 8.2.3.2.3 Field of View (FoV)
          4. 8.2.3.2.4 Lens
          5. 8.2.3.2.5 Integration Duty Cycle
          6. 8.2.3.2.6 Design Summary
        3. 8.2.3.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 MIX Supply Decapacitors
      2. 10.1.2 LVDS Transmitters
      3. 10.1.3 Optical Centering
      4. 10.1.4 Image Orientation
      5. 10.1.5 Thermal Considerations
    2. 10.2 Layout Example
    3. 10.3 Mechanical Assembly Guidelines
      1. 10.3.1 Board-Level Reliability
      2. 10.3.2 Handling
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Imaging Array:
    • 320 × 240 Array
    • 1/3” Optical Format
    • Pixel Pitch: 15 µm
    • Up to 150 Frames per Second
  • Optical Properties:
    • Responsivity: 0.35 A/W at 850 nm
    • Demodulation Contrast: 45% at 50 MHz
    • Demodulation Frequency: 10 MHz to 100 MHz
  • Output Data Format:
    • 12-Bit Phase Correlation Data
    • 4-Bit Common-Mode (Ambient)
  • Chipset Interface:
    • Compatible with TI's Time-of-Flight Controller OPT9221
  • Sensor Output Interface:
    • CMOS Data Interface (50-MHz DDR, 16-Lane Data, Clock and Frame Markers)
    • LVDS:
      • 600 Mbps, 3 Data Pairs
      • 1-LVDS Bit Clock Pair, 1-LVDS Sample Clock Pair
  • Timing Generator (TG):
    • Addressing Engine with Programmable Region of Interest (ROI)
    • Modulation Control
    • De-Aliasing
    • Master, Slave Sync Operation
  • I2C Slave Interface for Control
  • Power Supply:
    • 3.3-V I/O, Analog
    • 1.8-V Analog, Digital, I/O
    • 1.5-V Demodulation (Typical)
  • Optimized Optical Package (COG-78):
    • 8.757 mm × 7.859 mm × 0.7 mm
    • Integrated Optical Band-Pass Filter
      (830 nm to 867 nm)
    • Optical Fiducials for Easy Alignment
  • Operating Temperature: 0°C to 70°C

2 Applications

  • Depth Sensing:
    • Location and Proximity Sensing
    • 3D Scanning
    • 3D Machine Vision
    • Security and Surveillance
    • Gesture Controls
    • Augmented and Virtual Reality

3 Description

The OPT8241 time-of-flight (ToF) sensor is part of the TI 3D ToF image sensor family. The device combines ToF sensing with an optimally-designed analog-to-digital converter (ADC) and a versatile, programmable timing generator (TG). The device offers quarter video graphics array (QVGA 320 x 240) resolution data at frame rates up to 150 frames per second (600 readouts per second).

The built-in TG controls the reset, modulation, readout, and digitization sequence. The programmability of the TG offers flexibility to optimize for various depth-sensing performance metrics (such as power, motion robustness, signal-to-noise ratio, and ambient cancellation).

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
OPT8241 COG (78) 7.859 mm × 8.757 mm
  1. For all available packages, see the package option addendum at the end of the data sheet.

Block Diagram

OPT8241 frontpage_sbas704.gif

4 Revision History

Changes from A Revision (June 2015) to B Revision

  • Changed equations to correct format throughout document Go
  • Changed name of Function column in Pin Functions table Go
  • Changed SCL and SDATA pin descriptions in Pin Functions table Go
  • Added parameter names to Sensor section of Electrical Characteristics table Go
  • Changed depth resolution description in Table 5 Go

Changes from * Revision (June 2015) to A Revision

  • Released to productionGo