SCPS068J July   2001  – March 2015 PCF8574

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Interface Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
      1. 8.2.1 Simplified Block Diagram of Device
      2. 8.2.2 Simplified Schematic Diagram of Each P-Port Input/Output
    3. 8.3 Feature Description
      1. 8.3.1 I2C Interface
      2. 8.3.2 Interface Definition
      3. 8.3.3 Address Reference
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Minimizing ICC When I/Os Control LEDs
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Power-On Reset Requirements
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VCC Supply voltage range –0.5 7 V
VI Input voltage range(2) –0.5 VCC + 0.5 V
VO Output voltage range(2) –0.5 VCC + 0.5 V
IIK Input clamp current VI < 0 –20 mA
IOK Output clamp current VO < 0 –20 mA
IOK Input/output clamp current VO < 0 or VO > VCC ±400 μA
IOL Continuous output low current VO = 0 to VCC 50 mA
IOH Continuous output high current VO = 0 to VCC –4 mA
Continuous current through VCC or GND ±100 mA
TJ Junction temperature 150 °C
Tstg Storage temperature range –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) 1500 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) 2000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 500-V HBM is possible with the necessary precautions.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 250-V CDM is possible with the necessary precautions.

6.3 Recommended Operating Conditions

MIN MAX UNIT
VCC Supply voltage 2.5 6 V
VIH High-level input voltage 0.7 × VCC VCC + 0.5 V
VIL Low-level input voltage –0.5 0.3 × VCC V
IOH High-level output current –1 mA
IOL Low-level output current 25 mA
TA Operating free-air temperature –40 85 °C

6.4 Thermal Information

THERMAL METRIC(1) PCF8574 UNIT
DGV DW N PW RGT RGY
20 PINS 16 PINS 16 PINS 20 PINS 16 PINS 20 PINS
θJA Junction-to-ambient thermal resistance 92 57 67 83 53 37 °C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report (SPRA953).

6.5 Electrical Characteristics

over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS VCC MIN TYP(1) MAX UNIT
VIK Input diode clamp voltage II = –18 mA 2.5 V to 6 V –1.2 V
VPOR Power-on reset voltage(2) VI = VCC or GND, IO = 0 6 V 1.3 2.4 V
IOH P port VO = GND 2.5 V to 6 V 30 300 μA
IOHT P port transient pullup current High during acknowledge, VOH = GND 2.5 V –1 mA
IOL SDA VO = 0.4 V 2.5 V to 6 V 3 mA
P port VO = 1 V 5 V 10 25
INT VO = 0.4 V 2.5 V to 6 V 1.6
II SCL, SDA VI = VCC or GND 2.5 V to 6 V ±5 μA
INT ±5
A0, A1, A2 ±5
IIHL P port VI  ≥ VCC or VI  ≤ GND 2.5 V to 6 V ±400 μA
ICC Operating mode VI = VCC or GND, IO = 0, fSCL = 100 kHz 6 V 40 100 μA
Standby mode VI = VCC or GND, IO = 0 2.5 10
Ci SCL VI = VCC or GND 2.5 V to 6 V 1.5 7 pF
Cio SDA VIO = VCC or GND 2.5 V to 6 V 3 7 pF
P port 4 10
(1) All typical values are at VCC = 5 V, TA = 25°C.
(2) The power-on reset circuit resets the I2C-bus logic with VCC < VPOR and sets all I/Os to logic high (with current source to VCC).

6.6 I2C Interface Timing Requirements

over recommended operating free-air temperature range (unless otherwise noted) (see Figure 12)
MIN MAX UNIT
fscl I2C clock frequency 100 kHz
tsch I2C clock high time 4 μs
tscl I2C clock low time 4.7 μs
tsp I2C spike time 100 ns
tsds I2C serial data setup time 250 ns
tsdh I2C serial data hold time 0 ns
ticr I2C input rise time 1 μs
ticf I2C input fall time 0.3 μs
tocf I2C output fall time (10-pF to 400-pF bus) 300 ns
tbuf I2C bus free time between stop and start 4.7 μs
tsts I2C start or repeated start condition setup 4.7 μs
tsth I2C start or repeated start condition hold 4 μs
tsps I2C stop condition setup 4 μs
tvd Valid data time SCL low to SDA output valid 3.4 μs
Cb I2C bus capacitive load 400 pF

6.7 Switching Characteristics

over recommended operating free-air temperature range, CL ≤ 100 pF (unless otherwise noted) (see Figure 13)
PARAMETER FROM
(INPUT)
TO
(OUTPUT)
MIN MAX UNIT
tpv Output data valid SCL P port 4 μs
tsu Input data setup time P port SCL 0 μs
th Input data hold time P port SCL 4 μs
tiv Interrupt valid time P port INT 4 μs
tir Interrupt reset delay time SCL INT 4 μs

6.8 Typical Characteristics

TA = 25°C (unless otherwise noted)
PCF8574 tc001_scps068.gif
Figure 1. Supply Current vs Temperature
PCF8574 tc003_scps068.gif
Figure 3. Supply Current vs Supply Voltage
PCF8574 tc005_scps068.gif
Figure 5. I/O Sink Current vs Output Low Voltage
PCF8574 tc007_scps068.gif
Figure 7. I/O Output Low Voltage vs Temperature
PCF8574 tc009_scps068.gif
Figure 9. I/O Source Current vs Output High Voltage
PCF8574 tc011_scps068.gif
Figure 11. I/O High Voltage vs Temperature
PCF8574 tc002_scps068.gif
Figure 2. Standby Supply Current vs Temperature
PCF8574 tc004_scps068.gif
Figure 4. I/O Sink Current vs Output Low Voltage
PCF8574 tc006_scps068.gif
Figure 6. I/O Sink Current vs Output Low Voltage
PCF8574 tc008_scps068.gif
Figure 8. I/O Source Current vs Output High Voltage
PCF8574 tc010_scps068.gif
Figure 10. I/O Source Current vs Output High Voltage