SBAS989 April   2019 PCM1840

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Simplified Block Diagram
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements: TDM, I2S or LJ Interface
    7. 6.7 Switching Characteristics: TDM, I2S or LJ Interface
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Hardware Control
      2. 7.3.2 Audio Serial Interfaces
        1. 7.3.2.1 Time Division Multiplexed Audio (TDM) Interface
        2. 7.3.2.2 Inter IC Sound (I2S) Interface
        3. 7.3.2.3 Left-Justified (LJ) Interface
      3. 7.3.3 Phase-Locked Loop (PLL) and Clock Generation
      4. 7.3.4 Input Channel Configurations
      5. 7.3.5 Reference Voltage
      6. 7.3.6 Microphone Bias
      7. 7.3.7 Signal-Chain Processing
        1. 7.3.7.1 Digital High-Pass Filter
        2. 7.3.7.2 Configurable Digital Decimation Filters
          1. 7.3.7.2.1 Linear Phase Filters
            1. 7.3.7.2.1.1 Sampling Rate: 8 kHz or 7.35 kHz
            2. 7.3.7.2.1.2 Sampling Rate: 16 kHz or 14.7 kHz
            3. 7.3.7.2.1.3 Sampling Rate: 24 kHz or 22.05 kHz
            4. 7.3.7.2.1.4 Sampling Rate: 32 kHz or 29.4 kHz
            5. 7.3.7.2.1.5 Sampling Rate: 48 kHz or 44.1 kHz
            6. 7.3.7.2.1.6 Sampling Rate: 96 kHz or 88.2 kHz
            7. 7.3.7.2.1.7 Sampling Rate: 192 kHz or 176.4 kHz
          2. 7.3.7.2.2 Low-Latency Filters
            1. 7.3.7.2.2.1 Sampling Rate: 16 kHz or 14.7 kHz
            2. 7.3.7.2.2.2 Sampling Rate: 24 kHz or 22.05 kHz
            3. 7.3.7.2.2.3 Sampling Rate: 32 kHz or 29.4 kHz
            4. 7.3.7.2.2.4 Sampling Rate: 48 kHz or 44.1 kHz
            5. 7.3.7.2.2.5 Sampling Rate: 96 kHz or 88.2 kHz
      8. 7.3.8 Dynamic Range Enhancer (DRE)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Hardware Shutdown
      2. 7.4.2 Active Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.6 Timing Requirements: TDM, I2S or LJ Interface

at TA = 25°C, IOVDD = 3.3 V or 1.8 V and 20-pF load on all outputs (unless otherwise noted); see Figure 3 for timing diagram
MIN NOM MAX UNIT
t(BCLK) BCLK period 40 ns
tH(BCLK) BCLK high pulse duration (1) 18 ns
tL(BCLK) BCLK low pulse duration (1) 18 ns
tSU(FSYNC) FSYNC setup time 8 ns
tHLD(FSYNC) FSYNC hold time 8 ns
tr(BCLK) BCLK rise time 10% - 90% rise time 10 ns
tf(BCLK) BCLK fall time 90% - 10% fall time 10 ns
(1) The BCLK minimum high or low pulse duration must be higher than 25 ns (to meet the timing specifications), if the SDOUT data line is latched on the opposite BCLK edge polarity than the edge used by the device to transmit SDOUT data.