SBASA12 December   2020 PCM6020-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics
    6. 7.6  Timing Requirements: I2C Interface
    7. 7.7  Switching Characteristics: I2C Interface
    8. 7.8  Timing Requirements: SPI Interface
    9. 7.9  Switching Characteristics: SPI Interface
    10. 7.10 Timing Requirements: TDM, I2S or LJ Interface
    11. 7.11 Switching Characteristics: TDM, I2S or LJ Interface
    12. 7.12 Timing Diagrams
    13. 7.13 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Serial Interfaces
        1. 8.3.1.1 Control Serial Interfaces
        2. 8.3.1.2 Audio Serial Interfaces
          1. 8.3.1.2.1 Time Division Multiplexed Audio (TDM) Interface
          2. 8.3.1.2.2 Inter IC Sound (I2S) Interface
          3. 8.3.1.2.3 Left-Justified (LJ) Interface
        3. 8.3.1.3 Using Multiple Devices With Shared Buses
      2. 8.3.2 Phase-Locked Loop (PLL) and Clock Generation
      3. 8.3.3 Input Channel Configuration
      4. 8.3.4 Reference Voltage
      5. 8.3.5 Microphone Bias
      6. 8.3.6 Input DC Fault Diagnostics
        1. 8.3.6.1 Fault Conditions
          1. 8.3.6.1.1 Input Pin Short to Ground
          2. 8.3.6.1.2 Input Pin Short to MICBIAS
          3. 8.3.6.1.3 Open Inputs
          4. 8.3.6.1.4 Short Between INxP and INxM
          5. 8.3.6.1.5 Input Pin Overvoltage
          6. 8.3.6.1.6 Input Pin Short to VBAT_IN
        2. 8.3.6.2 Fault Reporting
          1. 8.3.6.2.1 Overcurrent and Overtemperature Protection
      7. 8.3.7 Signal-Chain Processing
        1. 8.3.7.1 Programmable Channel Gain and Digital Volume Control
        2. 8.3.7.2 Programmable Channel Gain Calibration
        3. 8.3.7.3 Programmable Channel Phase Calibration
        4. 8.3.7.4 Programmable Digital High-Pass Filter
        5. 8.3.7.5 Programmable Digital Biquad Filters
        6. 8.3.7.6 Programmable Channel Summer and Digital Mixer
        7. 8.3.7.7 Configurable Digital Decimation Filters
          1. 8.3.7.7.1 Linear Phase Filters
            1. 8.3.7.7.1.1 Sampling Rate: 8 kHz or 7.35 kHz
            2. 8.3.7.7.1.2 Sampling Rate: 16 kHz or 14.7 kHz
            3. 8.3.7.7.1.3 Sampling Rate: 24 kHz or 22.05 kHz
            4. 8.3.7.7.1.4 Sampling Rate: 32 kHz or 29.4 kHz
            5. 8.3.7.7.1.5 Sampling Rate: 48 kHz or 44.1 kHz
            6. 8.3.7.7.1.6 Sampling Rate: 96 kHz or 88.2 kHz
            7. 8.3.7.7.1.7 Sampling Rate: 192 kHz or 176.4 kHz
            8. 8.3.7.7.1.8 Sampling Rate: 384 kHz or 352.8 kHz
            9. 8.3.7.7.1.9 Sampling Rate: 768 kHz or 705.6 kHz
          2. 8.3.7.7.2 Low-Latency Filters
            1. 8.3.7.7.2.1 Sampling Rate: 16 kHz or 14.7 kHz
            2. 8.3.7.7.2.2 Sampling Rate: 24 kHz or 22.05 kHz
            3. 8.3.7.7.2.3 Sampling Rate: 32 kHz or 29.4 kHz
            4. 8.3.7.7.2.4 Sampling Rate: 48 kHz or 44.1 kHz
            5. 8.3.7.7.2.5 Sampling Rate: 96 kHz or 88.2 kHz
            6. 8.3.7.7.2.6 Sampling Rate: 192 kHz or 176.4 kHz
          3. 8.3.7.7.3 Ultra-Low-Latency Filters
            1. 8.3.7.7.3.1 Sampling Rate: 16 kHz or 14.7 kHz
            2. 8.3.7.7.3.2 Sampling Rate: 24 kHz or 22.05 kHz
            3. 8.3.7.7.3.3 Sampling Rate: 32 kHz or 29.4 kHz
            4. 8.3.7.7.3.4 Sampling Rate: 48 kHz or 44.1 kHz
            5. 8.3.7.7.3.5 Sampling Rate: 96 kHz or 88.2 kHz
            6. 8.3.7.7.3.6 Sampling Rate: 192 kHz or 176.4 kHz
            7. 8.3.7.7.3.7 Sampling Rate: 384 kHz or 352.8 kHz
      8. 8.3.8 Automatic Gain Controller (AGC)
      9. 8.3.9 Interrupts, Status, and Digital I/O Pin Multiplexing
    4. 8.4 Device Functional Modes
      1. 8.4.1 Hardware Shutdown
      2. 8.4.2 Sleep Mode or Software Shutdown
      3. 8.4.3 Active Mode
      4. 8.4.4 Software Reset
    5. 8.5 Programming
      1. 8.5.1 Control Serial Interfaces
        1. 8.5.1.1 I2C Control Interface
          1. 8.5.1.1.1 General I2C Operation
          2. 8.5.1.1.2 I2C Single-Byte and Multiple-Byte Transfers
            1. 8.5.1.1.2.1 I2C Single-Byte Write
            2. 8.5.1.1.2.2 I2C Multiple-Byte Write
            3. 8.5.1.1.2.3 I2C Single-Byte Read
            4. 8.5.1.1.2.4 I2C Multiple-Byte Read
        2. 8.5.1.2 SPI Control Interface
    6. 8.6 Register Maps
      1. 8.6.1 Device Configuration Registers
        1. 8.6.1.1 Registers Access Type
        2. 8.6.1.2 Page 0 Registers
        3. 8.6.1.3 Page 1 Registers
      2. 8.6.2 Programmable Coefficient Registers
        1. 8.6.2.1 Programmable Coefficient Registers: Page 2
        2. 8.6.2.2 Programmable Coefficient Registers: Page 3
        3. 8.6.2.3 Programmable Coefficient Registers: Page 4
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 2-Channel Analog Microphone Recording Using the PCM6020-Q1
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Example Device Register Configuration Script for EVM Setup
        3. 9.2.1.3 Application Curves
    3. 9.3 What To Do and What Not To Do
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information
8.5.1.1.2.3 I2C Single-Byte Read

As shown in Figure 8-69, a single-byte data read transfer begins with the master device transmitting a START condition followed by the I2C slave address and the read/write bit. For the data read transfer, both a write followed by a read are done. Initially, a write is done to transfer the address byte of the internal register address to be read. As a result, the read/write bit is set to 0.

After receiving the slave address and the read/write bit, the device responds with an acknowledge bit (ACK). The master device then sends the internal register address byte, after which the device issues an acknowledge bit (ACK). The master device transmits another START condition followed by the slave address and the read/write bit again. This time, the read/write bit is set to 1, indicating a read transfer. Next, the device transmits the data byte from the register address being read. After receiving the data byte, the master device transmits a not-acknowledge (NACK) followed by a STOP condition to complete the single-byte data read transfer.

GUID-FD450CD0-5259-4445-A68A-E3052B742DC3-low.gifFigure 8-69 I2C Single-Byte Read Transfer