SBASA12 December   2020 PCM6020-Q1

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics
    6. 7.6  Timing Requirements: I2C Interface
    7. 7.7  Switching Characteristics: I2C Interface
    8. 7.8  Timing Requirements: SPI Interface
    9. 7.9  Switching Characteristics: SPI Interface
    10. 7.10 Timing Requirements: TDM, I2S or LJ Interface
    11. 7.11 Switching Characteristics: TDM, I2S or LJ Interface
    12. 7.12 Timing Diagrams
    13. 7.13 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Serial Interfaces
        1. 8.3.1.1 Control Serial Interfaces
        2. 8.3.1.2 Audio Serial Interfaces
          1. 8.3.1.2.1 Time Division Multiplexed Audio (TDM) Interface
          2. 8.3.1.2.2 Inter IC Sound (I2S) Interface
          3. 8.3.1.2.3 Left-Justified (LJ) Interface
        3. 8.3.1.3 Using Multiple Devices With Shared Buses
      2. 8.3.2 Phase-Locked Loop (PLL) and Clock Generation
      3. 8.3.3 Input Channel Configuration
      4. 8.3.4 Reference Voltage
      5. 8.3.5 Microphone Bias
      6. 8.3.6 Input DC Fault Diagnostics
        1. 8.3.6.1 Fault Conditions
          1. 8.3.6.1.1 Input Pin Short to Ground
          2. 8.3.6.1.2 Input Pin Short to MICBIAS
          3. 8.3.6.1.3 Open Inputs
          4. 8.3.6.1.4 Short Between INxP and INxM
          5. 8.3.6.1.5 Input Pin Overvoltage
          6. 8.3.6.1.6 Input Pin Short to VBAT_IN
        2. 8.3.6.2 Fault Reporting
          1. 8.3.6.2.1 Overcurrent and Overtemperature Protection
      7. 8.3.7 Signal-Chain Processing
        1. 8.3.7.1 Programmable Channel Gain and Digital Volume Control
        2. 8.3.7.2 Programmable Channel Gain Calibration
        3. 8.3.7.3 Programmable Channel Phase Calibration
        4. 8.3.7.4 Programmable Digital High-Pass Filter
        5. 8.3.7.5 Programmable Digital Biquad Filters
        6. 8.3.7.6 Programmable Channel Summer and Digital Mixer
        7. 8.3.7.7 Configurable Digital Decimation Filters
          1. 8.3.7.7.1 Linear Phase Filters
            1. 8.3.7.7.1.1 Sampling Rate: 8 kHz or 7.35 kHz
            2. 8.3.7.7.1.2 Sampling Rate: 16 kHz or 14.7 kHz
            3. 8.3.7.7.1.3 Sampling Rate: 24 kHz or 22.05 kHz
            4. 8.3.7.7.1.4 Sampling Rate: 32 kHz or 29.4 kHz
            5. 8.3.7.7.1.5 Sampling Rate: 48 kHz or 44.1 kHz
            6. 8.3.7.7.1.6 Sampling Rate: 96 kHz or 88.2 kHz
            7. 8.3.7.7.1.7 Sampling Rate: 192 kHz or 176.4 kHz
            8. 8.3.7.7.1.8 Sampling Rate: 384 kHz or 352.8 kHz
            9. 8.3.7.7.1.9 Sampling Rate: 768 kHz or 705.6 kHz
          2. 8.3.7.7.2 Low-Latency Filters
            1. 8.3.7.7.2.1 Sampling Rate: 16 kHz or 14.7 kHz
            2. 8.3.7.7.2.2 Sampling Rate: 24 kHz or 22.05 kHz
            3. 8.3.7.7.2.3 Sampling Rate: 32 kHz or 29.4 kHz
            4. 8.3.7.7.2.4 Sampling Rate: 48 kHz or 44.1 kHz
            5. 8.3.7.7.2.5 Sampling Rate: 96 kHz or 88.2 kHz
            6. 8.3.7.7.2.6 Sampling Rate: 192 kHz or 176.4 kHz
          3. 8.3.7.7.3 Ultra-Low-Latency Filters
            1. 8.3.7.7.3.1 Sampling Rate: 16 kHz or 14.7 kHz
            2. 8.3.7.7.3.2 Sampling Rate: 24 kHz or 22.05 kHz
            3. 8.3.7.7.3.3 Sampling Rate: 32 kHz or 29.4 kHz
            4. 8.3.7.7.3.4 Sampling Rate: 48 kHz or 44.1 kHz
            5. 8.3.7.7.3.5 Sampling Rate: 96 kHz or 88.2 kHz
            6. 8.3.7.7.3.6 Sampling Rate: 192 kHz or 176.4 kHz
            7. 8.3.7.7.3.7 Sampling Rate: 384 kHz or 352.8 kHz
      8. 8.3.8 Automatic Gain Controller (AGC)
      9. 8.3.9 Interrupts, Status, and Digital I/O Pin Multiplexing
    4. 8.4 Device Functional Modes
      1. 8.4.1 Hardware Shutdown
      2. 8.4.2 Sleep Mode or Software Shutdown
      3. 8.4.3 Active Mode
      4. 8.4.4 Software Reset
    5. 8.5 Programming
      1. 8.5.1 Control Serial Interfaces
        1. 8.5.1.1 I2C Control Interface
          1. 8.5.1.1.1 General I2C Operation
          2. 8.5.1.1.2 I2C Single-Byte and Multiple-Byte Transfers
            1. 8.5.1.1.2.1 I2C Single-Byte Write
            2. 8.5.1.1.2.2 I2C Multiple-Byte Write
            3. 8.5.1.1.2.3 I2C Single-Byte Read
            4. 8.5.1.1.2.4 I2C Multiple-Byte Read
        2. 8.5.1.2 SPI Control Interface
    6. 8.6 Register Maps
      1. 8.6.1 Device Configuration Registers
        1. 8.6.1.1 Registers Access Type
        2. 8.6.1.2 Page 0 Registers
        3. 8.6.1.3 Page 1 Registers
      2. 8.6.2 Programmable Coefficient Registers
        1. 8.6.2.1 Programmable Coefficient Registers: Page 2
        2. 8.6.2.2 Programmable Coefficient Registers: Page 3
        3. 8.6.2.3 Programmable Coefficient Registers: Page 4
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 2-Channel Analog Microphone Recording Using the PCM6020-Q1
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Example Device Register Configuration Script for EVM Setup
        3. 9.2.1.3 Application Curves
    3. 9.3 What To Do and What Not To Do
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Detailed Design Procedure

This section describes the necessary steps to configure the PCM6020-Q1 for this specific application. The following steps give a sequence of items that must be executed in the time between powering the device up and reading data from the device or transitioning from one mode to other mode of operation.

  1. Apply power to the device:
    1. Power up the IOVDD, AVDD, and BSTVDD power supplies, keeping the SHDNZ pin voltage low
    2. The device now goes into hardware shutdown mode (ultra-low-power mode < 1 µA)
  2. Transition from hardware shutdown mode to sleep mode (or software shutdown mode):
    1. Release SHDNZ only when the IOVDD, AVDD, and BSTVDD power supplies settle to the steady-state operating voltage
    2. Wait for at least 1 ms to allow the device to initialize the internal registers
    3. The device now goes into sleep mode (low-power mode < 20 µA)
  3. Transition from sleep mode to active mode whenever required for the record operation:
    1. Wake-up the device by writing P0_R2 to disable sleep mode
    2. Wait for at least 1ms to allow the device internal wake-up sequence to complete
    3. Override the default configuration registers or programmable coefficients value as required (optional)
    4. Enable all desired input channels by writing P0_R115
    5. Enable all desired audio serial interface output channels by writing P0_R116
    6. Power-up the ADC, MICBIAS, and PLL by writing P0_R117
    7. Apply FSYNC and BCLK with the desired output sample rates and the BCLK to FSYNC ratio

      This specific step can be done at any point in the sequence after step a

      See the Section 8.3.2 section for the supported sample rates and the BCLK to FSYNC ratio

    8. The device recording data are now sent to the host processor via the TDM audio serial data bus
    9. Wait for at least 10 ms to allow the MICBIAS to power up
    10. Enable the fault diagnostics for all desired input channels by writing P0_R100
  4. Transition from active mode to sleep mode (again) as required in the system low power:
    1. Disable the fault diagnostics for all desired input channels by writing P0_R100
    2. Go to sleep mode by writing P0_R2 to enable sleep mode
    3. Wait at least 20 ms to allow the volume to gradually ramp down and for all blocks to power down
    4. Read P0_R119 to check the device shutdown and sleep mode status
    5. If the device P0_R119_D7 status bit is 1'b1, then stop FSYNC and BCLK in the system
    6. The device now goes into sleep mode (low-power mode < 20 µA) and retains all register values
  5. Transition from sleep mode to active mode (again) as required for the record operation:
    1. Wake-up the device by writing P0_R2 to disable sleep mode
    2. Wait for at least 1 ms to allow the device internal wake-up sequence to complete
    3. Apply FSYNC and BCLK with the desired output sample rates and BCLK to FSYNC ratio
    4. The device recording data are now sent to the host processor via the TDM audio serial data bus
    5. Wait for at least 10 ms to allow the MICBIAS to power up
    6. Enable the fault diagnostics for all desired input channels by writing P0_R100
  6. Repeat step 4 and step 5 as required for mode transitions
  7. Assert the SHDNZ pin low to enter hardware shutdown mode (again) at any time
  8. Follow step 2 onwards to exit hardware shutdown mode (again)