SLDS204B October 2014 – June 2020 PGA300
PRODUCTION DATA.
Standard layout practices should be used when designing a board to test the PGA300. Depending on the number of layers in the board, one or more GND planes should be inserted as internal layers. However, given the limited number of external components needed for an application using the PGA300 and the number of NU pins in the device, a simple two-layer board can easily be designed. In addition, the PWR decoupling capacitor should be placed as close as possible to the PWR pin. In a similar way, the 100-nF recommended capacitors for the AVDD and DVDD regulators as well as the 10- to 1000-nF recommended capacitor for REFCAP should be placed as close as possible to their respective pins.
Depending on the application, the signal traces for FB–, FB+, COMP, and OUT should be routed such that they do not cross one another in order to minimize coupling.
When using the internal temperature sensor, thermal effects must be taken into account in the board design. Place the PGA300 as close as possible to the pressure-sensing element. This placement ensures that the internal temperature sensor has adequate thermal coupling to the sensing element. Additionally, if the device is used in 4-mA to 20-mA output mode with the internal temperature sensor, place the BJT as far away as possible from the PGA300 and the pressure-sensing element to reduce additional heating at high current outputs.