SBOS600D May   2014  – July 2018 REF2025 , REF2030 , REF2033 , REF2041

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      Application Example
      2.      VREF and VBIAS vs Temperature
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
    1.     Pin Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. Parameter Measurement Information
    1. 8.1 Solder Heat Shift
    2. 8.2 Thermal Hysteresis
    3. 8.3 Noise Performance
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 VREF and VBIAS Tracking
      2. 9.3.2 Low Temperature Drift
      3. 9.3.3 Load Current
    4. 9.4 Device Functional Modes
  10. 10Applications and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Low-Side, Current-Sensing Application
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
          1. 10.2.1.2.1 Shunt Resistor
          2. 10.2.1.2.2 Differential Amplifier
          3. 10.2.1.2.3 Voltage Reference
          4. 10.2.1.2.4 Results
        3. 10.2.1.3 Application Curves
  11. 11Power-Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Related Links
    3. 13.3 Receiving Notification of Documentation Updates
    4. 13.4 Community Resources
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Thermal Hysteresis

Thermal hysteresis is measured with the REF20xx soldered to a PCB, similar to a real-world application. Thermal hysteresis for the device is defined as the change in output voltage after operating the device at 25°C, cycling the device through the specified temperature range, and returning to 25°C. Hysteresis can be expressed by Equation 1:

Equation 1. REF2025 REF2030 REF2033 REF2041 q_hysteresis_sbos600.gif

where

  • VHYST = thermal hysteresis (in units of ppm),
  • VNOM = the specified output voltage,
  • VPRE = output voltage measured at 25°C pre-temperature cycling, and
  • VPOST = output voltage measured after the device has cycled from 25°C through the specified temperature range of –40°C to 125°C and returns to 25°C.

Typical thermal hysteresis distribution is as shown in Figure 43 and Figure 44.

REF2025 REF2030 REF2033 REF2041 C013_SBOS600.pngFigure 43. Thermal Hysteresis Distribution (VREF)
REF2025 REF2030 REF2033 REF2041 C014_SBOS600.pngFigure 44. Thermal Hysteresis Distribution (VBIAS)