SBAS901C July   2018  – October 2020 REF34-Q1

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
    1. 6.1 Pin Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
  8. Typical Characteristics
  9. Parameter Measurement Information
    1. 9.1 Solder Heat Shift
    2. 9.2 Long-Term Stability
    3. 9.3 Thermal Hysteresis
    4. 9.4 Power Dissipation
    5. 9.5 Noise Performance
  10. 10Detailed Description
    1. 10.1 Overview
    2. 10.2 Functional Block Diagram
    3. 10.3 Feature Description
      1. 10.3.1 Supply Voltage
      2. 10.3.2 Low Temperature Drift
      3. 10.3.3 Load Current
    4. 10.4 Device Functional Modes
      1. 10.4.1 EN Pin
  11. 11Application and Implementation
    1. 11.1 Application Information
    2. 11.2 Typical Applications
      1. 11.2.1 Basic Voltage Reference Connection
        1. 11.2.1.1 Design Requirements
        2. 11.2.1.2 Detailed Design Procedure
          1. 11.2.1.2.1 Input and Output Capacitors
          2. 11.2.1.2.2 4-Wire Kelvin Connections
          3. 11.2.1.2.3 VIN Slew Rate Considerations
          4. 11.2.1.2.4 Shutdown/Enable Feature
        3. 11.2.1.3 Application Curves
      2. 11.2.2 Advanced Driver Assistance Systems (ADAS) Microcontroller Connection
        1. 11.2.2.1 Basic Voltage Reference Connection
        2. 11.2.2.2 Design Requirements
        3. 11.2.2.3 Detailed Design Procedure
        4. 11.2.2.4 Enable Feature in ADAS
  12. 12Power Supply Recommendations
  13. 13Layout
    1. 13.1 Layout Guidelines
    2. 13.2 Layout Example
  14. 14Device and Documentation Support
    1. 14.1 Documentation Support
      1. 14.1.1 Related Documentation
    2. 14.2 Receiving Notification of Documentation Updates
    3. 14.3 Support Resources
    4. 14.4 Trademarks
    5. 14.5 Electrostatic Discharge Caution
    6. 14.6 Glossary
  15. 15Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Thermal Information

THERMAL METRIC(1) REF34-Q1 UNIT
DBV DBV DGK
5 PINS 6 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 122.6 122.6 174.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 80.2 80.2 61.3 °C/W
RθJB Junction-to-board thermal resistance 42 42 95.5 °C/W
ΨJT Junction-to-top characterization parameter 23.2 23.2 8.5 °C/W
ΨJB Junction-to-board characterization parameter 41.9 41.9 93.9 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A N/A °C/W
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.