SBAS804F September   2017  – June 2021 REF3425 , REF3430 , REF3433 , REF3440 , REF3450

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1 Solder Heat Shift
    2. 8.2 Long-Term Stability
    3. 8.3 Thermal Hysteresis
    4. 8.4 Power Dissipation
    5. 8.5 Noise Performance
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Supply Voltage
      2. 9.3.2 Low Temperature Drift
      3. 9.3.3 Load Current
    4. 9.4 Device Functional Modes
      1. 9.4.1 EN Pin
      2. 9.4.2 Negative Reference Voltage
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application: Basic Voltage Reference Connection
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Input and Output Capacitors
        2. 10.2.2.2 4-Wire Kelvin Connections
        3. 10.2.2.3 VIN Slew Rate Considerations
        4. 10.2.2.4 Shutdown/Enable Feature
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Receiving Notification of Documentation Updates
    3. 13.3 Support Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.4 Power Dissipation

The REF34xx voltage references are capable of source and sink up to 10 mA of load current across the rated input voltage range. However, when used in applications subject to high ambient temperatures, the input voltage and load current must be carefully monitored to ensure that the device does not exceeded its maximum power dissipation rating. The maximum power dissipation of the device can be calculated with Equation 2:

Equation 2. GUID-82261879-F79D-4A9D-B822-ADEE08CDE322-low.gif

where

  • PD is the device power dissipation
  • TJ is the device junction temperature
  • TA is the ambient temperature
  • RθJA is the package (junction-to-air) thermal resistance

Because of this relationship, acceptable load current in high temperature conditions may be less than the maximum current-sourcing capability of the device. In no case should the device be operated outside of its maximum power rating because doing so can result in premature failure or permanent damage to the device.