SNAS809A December   2021  – August 2022 REF35

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1 Solder Heat Shift
    2. 8.2 Temperature Coefficient
    3. 8.3 Long-Term Stability
    4. 8.4 Thermal Hysteresis
    5. 8.5 Noise Performance
      1. 8.5.1 Low-Frequency (1/f) Noise
      2. 8.5.2 Broadband Noise
    6. 8.6 Power Dissipation
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Supply Voltage
      2. 9.3.2 EN Pin
      3. 9.3.3 NR Pin
    4. 9.4 Device Functional Modes
      1. 9.4.1 Basic Connections
      2. 9.4.2 Start-Up
      3. 9.4.3 Output Transient Behavior
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 Negative Reference Voltage
      2. 10.2.2 Precision Power Supply and Reference
        1. 10.2.2.1 Design Requirements
        2. 10.2.2.2 Detailed Design Procedure
          1. 10.2.2.2.1 Selection of Reference
          2. 10.2.2.2.2 Input and Output Capacitors
          3. 10.2.2.2.3 Selection of ADC
        3. 10.2.2.3 Application Curves
    3. 10.3 Power Supply Recommendations
    4. 10.4 Layout
      1. 10.4.1 Layout Guidelines
      2. 10.4.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Ultra-low quiescent current:
    • 650 nA (typical)
  • Initial accuracy: ±0.05% (maximum)
  • Temperature coefficient:
    • 12 ppm/°C (maximum for −40°C to 105°C)
  • Output 1/f noise (0.1 Hz to 10 Hz): 3.3 ppmP-P
  • NR pin to reduce noise
  • EN pin to reduce shutdown current consumption
  • Long-term stability: 40 ppm at 1k hour
  • Thermal hysteresis: 70 ppm
  • Specified temperature range: −40°C to +105°C
  • Operating temperature range: −55°C to +125°C
  • Output current: +10 mA, −5 mA
  • Input voltage: VREF + VDO to 6 V
  • Output voltage options:
    • 1.024 V, 1.2 V, 1.25 V, 1.6 V, 1.8 V, 2.048 V,
      2.5 V, 3.0 V, 3.3 V, 4.096 V, 5.0 V
  • Small footprint 6-pin SOT−23 package
  • Smallest footprint 4-pin WCSP package