SLLSF98 December   2018 SN55HVD233-SEP

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Driver Electrical Characteristics
    6. 7.6  Receiver Electrical Characteristics
    7. 7.7  Driver Switching Characteristics
    8. 7.8  Receiver Switching Characteristics
    9. 7.9  Device Switching Characteristics
    10. 7.10 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Modes
      2. 9.3.2 Loopback
      3. 9.3.3 CAN Bus States
      4. 9.3.4 ISO 11898 Compliance of SN55HVD233-SEP
        1. 9.3.4.1 Introduction
        2. 9.3.4.2 Differential Signal
          1. 9.3.4.2.1 Common-Mode Signal
        3. 9.3.4.3 Interoperability of 3.3-V CAN in 5-V CAN Systems
      5. 9.3.5 Thermal Shutdown
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Diagnostic Loopback
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Slope Control
        2. 10.2.2.2 Standby
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 Bus Loading, Length, and Number of Nodes
      2. 12.1.2 CAN Termination
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Receiving Notification of Documentation Updates
    2. 13.2 Community Resources
    3. 13.3 Trademarks
    4. 13.4 Electrostatic Discharge Caution
    5. 13.5 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.7 Driver Switching Characteristics

At TA = –55°C to 125°C, unless otherwise noted.
PARAMETER TEST CONDITIONS MIN TYP(1) MAX UNIT
tPLH Propagation delay time,
low-to-high-level output		 V(RS) = 0 V, see Figure 15 35 85 ns
RS with 10 kΩ to ground, see Figure 15 70 125
RS with 50 kΩ to ground, see Figure 15 500 870
tPHL Propagation delay time,
high-to-low-level output		 V(RS) = 0 V, see Figure 15 70 120 ns
RS with 10 kΩ to ground, see Figure 15 130 180
RS with 50 kΩ to ground, see Figure 15 870 1200
tsk(p) Pulse skew (|tPHL – tPLH|) V(RS) = 0 V, see Figure 15 35 ns
RS with 10 kΩ to ground, see Figure 15 60
RS with 50 kΩ to ground, see Figure 15 370
tr Differential output signal rise time V(RS) = 0 V, see Figure 15 20 70 ns
tf Differential output signal fall time 20 70 ns
tr Differential output signal rise time RS with 10 kΩ to ground, see Figure 15 30 135 ns
tf Differential output signal fall time 30 135 ns
tr Differential output signal rise time RS with 50 kΩ to ground, see Figure 15 350 1400 ns
tf Differential output signal fall time 350 1400 ns
ten(s) Enable time from standby to dominant See Figure 19 0.6 1.5 µs
(1) All typical values are at 25°C and with a 3.3-V supply.