SLLSFI7 October   2020 SN65HVD64

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Coaxial Interface
      2. 8.3.2 Reference Input
      3. 8.3.3 RS-485 Direction Control
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Driver Amplitude Adjust
      2. 9.1.2 Direction Control
      3. 9.1.3 Direction Control Time Constant
      4. 9.1.4 Conversion Between dBm and Peak-to-Peak Voltage
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.3 Recommended Operating Conditions

MIN NOM MAX UNIT
VCC Analog supply voltage 3 5.5 V
VL Logic supply voltage 1.6 5.5 V
VI(pp) Input signal amplitude at RXIN 1.12 Vpp
VIH High-level input voltage TXIN, DIRSET1, DIRSET2 70%VL VL V
XTAL1, XTAL2 70%VCC VCC
VIL Low-level input voltage TXIN, DIRSET1, DIRSET2 0 30%VL V
XTAL1, XTAL2 0 30%VCC
1/tUI Data signaling rate 9.6 115 kbps
FOSC Oscillator frequency –30 ppm 8.704 30 ppm MHz
ZLOAD Load impedance between TXOUT to RXIN 50 Ω
Load impedance between RXIN and GND at fC (channel) 50 Ω
R1 Bias resistor between BIAS and RES 4.1 kΩ
R2 Bias resistor between RES and GND 10 kΩ
RSYNC Pullup resistor between SYNCOUT and VCC 1 kΩ
VRES Voltage at RES pin 0.7 1.5 V
CC Coupling capacitance between RXIN and coax (channel) 220 nF
CBIAS Capacitance between BIAS and GND 1 µF
TA Operating free-air temperature –40 120 °C
TJ Junction temperature –40 125 °C