SLLSEH3C July   2013  – January 2018 SN65HVD888

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings: JEDEC Specifications
    3. 6.3 ESD Ratings: IEC Specifications
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Electrical Characteristics
    7. 6.7 Power Dissipation Characteristics
    8. 6.8 Switching Characteristics
    9. 6.9 Typical Characteristics
  7. 7 Parameter Measurement information
    1. 7.1 Driver
    2. 7.2 Receiver
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Low-Power Standby Mode
      2. 8.3.2 Bus Polarity Correction
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Device Configuration
      2. 9.1.2 Bus Design
      3. 9.1.3 Cable Length Versus Data Rate
      4. 9.1.4 Stub Length
      5. 9.1.5 3- to 5-V Interface
      6. 9.1.6 Noise Immunity
      7. 9.1.7 Transient Protection
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Design and Layout Considerations For Transient Protection
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from B Revision (June 2017) to C Revision

Changes from A Revision (September 2015) to B Revision

  • Changed text From: "characterized from –40°C to 85°C" To: "characterized from –40°C to 125°C" in the DescriptionGo
  • Changed the TA MAX value From: 85°C To: 125°C in the Recommended Operating Conditions tableGo
  • Changed ICC to show values for the temperature ranges of –40°C to 85°C and –40°C to 125°C in the Electrical Characteristics tableGo

Changes from * Revision (July 2013) to A Revision

  • Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
  • Changed JEDEC Standard 22, Test Method A114 (HBM) from ±4 to ±8 kV.Go
  • Changed JEDEC Standard 22, Test Method A115 (Machine Model) from ±100 to ±200 V.Go
  • Changed the "D and RE Inputs" circuit and the "DE Input" circuit of Figure 15Go