SLLS396G SEPTEMBER   1999  – December 2015 SN65LVDS104 , SN65LVDS105

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Selection Guide to LVDS Repeaters
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings—JEDEC
    3. 7.3  ESD Ratings—MIL-STD
    4. 7.4  Recommended Operating Conditions
    5. 7.5  Thermal Information
    6. 7.6  SN65LVDS104 Electrical Characteristics
    7. 7.7  SN65LVDS105 Electrical Characteristics
    8. 7.8  SN65LVDS104 Switching Characteristics
    9. 7.9  SN65LVDS105 Switching Characteristics
    10. 7.10 Dissipation Ratings
    11. 7.11 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Fail Safe
    4. 9.4 Device Functional Modes
      1. 9.4.1 Input Level Translation
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Point-to-Point Communications
      2. 10.2.2 Design Requirements
      3. 10.2.3 Detailed Design Procedure
        1. 10.2.3.1  Bypass Capacitance
        2. 10.2.3.2  Driver Supply Voltage
        3. 10.2.3.3  Driver Input Voltage
        4. 10.2.3.4  Driver Output Voltage
        5. 10.2.3.5  Interconnecting Media
        6. 10.2.3.6  PCB Transmission Lines
        7. 10.2.3.7  Termination Resistor
        8. 10.2.3.8  Receiver Supply Voltage
        9. 10.2.3.9  Receiver Input Common-Mode Range
        10. 10.2.3.10 Receiver Input Signal
        11. 10.2.3.11 Receiver Output Signal
      4. 10.2.4 Application Curve
    3. 10.3 Multidrop Communications
      1. 10.3.1 Design Requirements
      2. 10.3.2 Detailed Design Procedure
        1. 10.3.2.1 Interconnecting Media
  11. 11Power Supply Recommendations
    1. 11.1 Coupling Capacitor Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 Microstrip vs. Stripline Topologies
      2. 12.1.2 Dielectric Type and Board Construction
      3. 12.1.3 Recommended Stack Layout
      4. 12.1.4 Separation Between Traces
      5. 12.1.5 Crosstalk and Ground Bounce Minimization
      6. 12.1.6 Decoupling
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Related Links
    2. 13.2 Community Resources
    3. 13.3 Trademarks
    4. 13.4 Electrostatic Discharge Caution
    5. 13.5 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • PW|16
  • D|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from F Revision (January 2005) to G Revision

  • Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go