SLLS573D December   2003  – December 2015 SN65MLVD200A , SN65MLVD202A , SN65MLVD204A , SN65MLVD205A

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics
    6. 7.6  Electrical Characteristics - Driver
    7. 7.7  Electrical Characteristics - Receiver
    8. 7.8  Electrical Characteristics - BUS Input and Output
    9. 7.9  Switching Characteristics - Driver
    10. 7.10 Switching Characteristics - Receiver
    11. 7.11 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Power-On Reset
      2. 9.3.2 ESD Protection
    4. 9.4 Device Functional Modes
      1. 9.4.1 Device Function Tables
      2. 9.4.2 Equivalent Input and Output Schematic Diagrams
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1  Supply Voltage
        2. 10.2.2.2  Supply Bypass Capacitance
        3. 10.2.2.3  Driver Input Voltage
        4. 10.2.2.4  Driver Output Voltage
        5. 10.2.2.5  Termination Resistors
        6. 10.2.2.6  Receiver Input Signal
        7. 10.2.2.7  Receiver Input Threshold (Failsafe)
        8. 10.2.2.8  Receiver Output Signal
        9. 10.2.2.9  Interconnecting Media
        10. 10.2.2.10 PCB Transmission Lines
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 Microstrip Versus Stripline Topologies
      2. 12.1.2 Dielectric Type and Board Construction
      3. 12.1.3 Recommended Stack Layout
      4. 12.1.4 Separation Between Traces
      5. 12.1.5 Crosstalk and Ground Bounce Minimization
      6. 12.1.6 Decoupling
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Related Links
    3. 13.3 Community Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

13 Device and Documentation Support

13.1 Documentation Support

13.1.1 Related Documentation

For related documentation, see the following:

  • Introduction to M-LVDS (TIA/EIA-899) (SLLA108)
  • LVDS Application and Data Handbook (SLLD009)
  • LVDS Owner's Manual Design Guide, 4th Edition (SNLA187)
  • Semiconductor and IC Package Thermal Metrics (SPRA953)
  • Howard Johnson and Martin Graham.1993. High Speed Digital Design – A Handbook of Black Magic. Prentice Hall PRT. ISBN number 013395724.
  • Mark I. Montrose. 1996. Printed Circuit Board Design Techniques for EMC Compliance. IEEE Press. ISBN number 0780311310.
  • Clyde F. Coombs. 1995. Printed Circuits Handbook. McGraw Hill. ISBN number 0070127549.

13.2 Related Links

The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy.

Table 8. Related Links

PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY
SN65MLVD200A Click here Click here Click here Click here Click here
SN65MLVD202A Click here Click here Click here Click here Click here
SN65MLVD204A Click here Click here Click here Click here Click here
SN65MLVD205A Click here Click here Click here Click here Click here

13.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

13.4 Trademarks

E2E is a trademark of Texas Instruments.

Rogers is a trademark of Rogers Corporation.

All other trademarks are the property of their respective owners.

13.5 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

13.6 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.