SLLS573D December   2003  – December 2015 SN65MLVD200A , SN65MLVD202A , SN65MLVD204A , SN65MLVD205A

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics
    6. 7.6  Electrical Characteristics - Driver
    7. 7.7  Electrical Characteristics - Receiver
    8. 7.8  Electrical Characteristics - BUS Input and Output
    9. 7.9  Switching Characteristics - Driver
    10. 7.10 Switching Characteristics - Receiver
    11. 7.11 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Power-On Reset
      2. 9.3.2 ESD Protection
    4. 9.4 Device Functional Modes
      1. 9.4.1 Device Function Tables
      2. 9.4.2 Equivalent Input and Output Schematic Diagrams
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1  Supply Voltage
        2. 10.2.2.2  Supply Bypass Capacitance
        3. 10.2.2.3  Driver Input Voltage
        4. 10.2.2.4  Driver Output Voltage
        5. 10.2.2.5  Termination Resistors
        6. 10.2.2.6  Receiver Input Signal
        7. 10.2.2.7  Receiver Input Threshold (Failsafe)
        8. 10.2.2.8  Receiver Output Signal
        9. 10.2.2.9  Interconnecting Media
        10. 10.2.2.10 PCB Transmission Lines
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 Microstrip Versus Stripline Topologies
      2. 12.1.2 Dielectric Type and Board Construction
      3. 12.1.3 Recommended Stack Layout
      4. 12.1.4 Separation Between Traces
      5. 12.1.5 Crosstalk and Ground Bounce Minimization
      6. 12.1.6 Decoupling
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Related Links
    3. 13.3 Community Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from C Revision (September 2015) to D Revision

  • Deleted Features list item "Meets ±8-kV IEC 61000-4-2, Contact Discharge" Go

Changes from B Revision (June 2015) to C Revision

  • Deleted row "Open Circuit" from Table 3 and Table 4 as redundant Go
  • Changed from "VID ≥ 50 mV " to "VID ≥ 150 mV " in Table 4 Go
  • Changed from "–50 mV < VID < 150 mV" to "50 mV < VID < 150 mV" in Table 4Go

Changes from A Revision (December 2003) to B Revision

  • Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
  • Removed SN65MLVD204B from the data sheetGo
  • Changed Ordering Information to Device Comparison TableGo
  • Deleted |VID| MIN value in Recommended Operating ConditionsGo
  • Changed Multipoint Configuration imageGo

Changes from * Revision (December 2003) to A Revision