SCAS517D June   1995  – August 2016 SN54ACT244 , SN74ACT244

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Operating Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Related Links
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Community Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DB|20
  • NS|20
  • N|20
  • DW|20
  • PW|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VCC Supply voltage –0.5 7 V
VI Input voltage(2) –0.5 VCC + 0.5 V
VO Output voltage(2) –0.5 VCC + 0.5 V
IIK Input clamp current VI < 0 or VI > VCC ±20 mA
IOK Output clamp current VO < 0 or VO > VCC ±20 mA
IO Continuous output current VO = 0 to VCC ±50 mA
Continuous current through VCC or GND ±200 mA
TJ Absolute Maximum Junction Temperature 150 °C
Tstg Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input and output voltage ratings may be exceeded if the input and output current ratings are observed.

6.2 ESD Ratings

VALUE UNIT
SN74ACT244 in DW Package
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±3000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±2000
SN54ACT244 in J, W, DB, N, NS, PW, FK Packages
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VCC Supply voltage 4.5 5.5 V
VIH High-level input voltage 2 V
VIL Low-level input voltage 0.8 V
VI Input voltage 0 VCC V
VO Output voltage 0 VCC V
IOH High-level output current –24 mA
IOL Low-level output current 24 mA
Δt/Δv Input transition rise or fall rate 8 ns/V
TA Operating free-air temperature SN54ACT244 –55 125 °C
SN74ACT244 –40 85
(1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. See the TI application report, Implications of Slow or Floating CMOS Inputs (SCBA004).

6.4 Thermal Information

THERMAL METRIC(1) SN74ACT244 UNIT
DB
(SSOP)		 DW
(SOIC)		 N
(PDIP)		 NS
(SO)		 PW
(TSSOP)
20 PINS 20 PINS 20 PINS 20 PINS 20 PINS
RθJA Junction-to-ambient thermal resistance 94.1 81.4 48.1 76.4 103 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 55.6 46.8 34.1 42.6 37.7 °C/W
RθJB Junction-to-board thermal resistance 49.3 49.3 29 43.9 54 °C/W
ψJT Junction-to-top characterization parameter 20.8 20 19.5 18.8 2.8 °C/W
ψJB Junction-to-board characterization parameter 48.9 48.8 28.9 43.5 53.5 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

6.5 Electrical Characteristics

over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS VCC MIN TYP MAX UNIT
VOH IOH = –50 µA TA = 25°C 4.5 V 4.4 4.49 V
SN54ACT244 4.4
SN74ACT244 4.4
TA = 25°C 5.5 V 5.4 5.49
SN54ACT244 5.4
SN74ACT244 5.4
IOH = –24 mA TA = 25°C 4.5 V 3.86
SN54ACT244 3.7
SN74ACT244 3.76
TA = 25°C 5.5 V 4.86
SN54ACT244 4.7
SN74ACT244 4.76
IOH = –50 mA(1) SN54ACT244 5.5 V 3.85
IOH = –75 mA(1) SN74ACT244 5.5 V 3.85
VOL IOL = 50 µA TA = 25°C 4.5 V 0.001 0.1 V
SN54ACT244 0.1
SN74ACT244 0.1
TA = 25°C 5.5 V 0.001 0.1
SN54ACT244 0.1
SN74ACT244 0.1
IOL = 24 mA TA = 25°C 4.5 V 0.36
SN54ACT244 0.5
SN74ACT244 0.44
TA = 25°C 5.5 V 0.36
SN54ACT244 0.5
SN74ACT244 0.44
IOL = 50 mA(1) SN54ACT244 5.5 V 1.65
IOL = 75 mA(1) SN74ACT244 5.5 V 1.65
IOZ VO = VCC or GND TA = 25°C 5.5 V ±0.25 µA
SN54ACT244 ±5
SN74ACT244 ±2.5
II VI = VCC or GND TA = 25°C 5.5 V ±0.1 µA
SN54ACT244 ±1
SN74ACT244 ±1
ICC VI = VCC or GND, IO = 0 TA = 25°C 5.5 V 4 µA
SN54ACT244 80
SN74ACT244 40
ΔICC(2) One input at 3.4 V,
Other inputs at GND or VCC		 TA = 25°C 5.5 V 0.6 mA
SN54ACT244 1.6
SN74ACT244 1.5
CI VI = VCC or GND TA = 25°C 5 V 2.5 pF
Co VI = VCC or GND TA = 25°C 5 V 8 pF
(1) Not more than one output should be tested at a time, and the duration of the test should not exceed 2 ms.
(2) This is the increase in supply current for each input that is at one of the specified TTL voltage levels, rather than 0 V or VCC.

6.6 Switching Characteristics

over recommended operating free-air temperature range, VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 2)
PARAMETER FROM
(INPUT)		 TO
(OUTPUT)		 TEST CONDITIONS MIN TYP MAX UNIT
tPLH A Y TA = 25°C 2 6.5 9 ns
SN54ACT244 1 10
SN74ACT244 1.5 10
tPHL TA = 25°C 2 7 9
SN54ACT244 1 10
SN74ACT244 1.5 10
tPZH OE Y TA = 25°C 1.5 7 8.5 ns
SN54ACT244 1 9.5
SN74ACT244 1 9.5
tPZL TA = 25°C 2 7 9.5
SN54ACT244 1 11
SN74ACT244 1.5 10.5
tPHZ OE Y TA = 25°C 2 8 9.5 ns
SN54ACT244 1 11
SN74ACT244 1.5 10.5
tPLZ TA = 25°C 2.5 7.5 10
SN54ACT244 1 11.5
SN74ACT244 2 10.5

6.7 Operating Characteristics

VCC = 5 V, TA = 25°C
PARAMETER TEST CONDITIONS TYP UNIT
Cpd Power dissipation capacitance per buffer/driver CL = 50 pF, f = 1 MHz 45 pF

6.8 Typical Characteristics

SN54ACT244 SN74ACT244 D003_scas517.gif
Figure 1. VOH Vs IOH