SCLS226N October   1995  – June 2025 SN54AHC244 , SN74AHC244

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Switching Characteristics, VCC = 3.3V ± 0.3V
    7. 5.7  Switching Characteristics, VCC = 5V ± 0.5V
    8. 5.8  Noise Characteristics
    9. 5.9  Operating Characteristics
    10. 5.10 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Balanced CMOS Push-Pull Outputs
      2. 7.3.2 Balanced CMOS 3-State Outputs
      3. 7.3.3 Standard CMOS Inputs
      4. 7.3.4 Clamp Diode Structure
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DGV|20
  • DB|20
  • RKS|20
  • NS|20
  • N|20
  • DGS|20
  • DW|20
  • PW|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.4.1 Layout Guidelines

  • Bypass capacitor placement
    • Place near the positive supply terminal of the device
    • Provide an electrically short ground return path
    • Use wide traces to minimize impedance
    • Keep the device, capacitors, and traces on the same side of the board whenever possible
  • Signal trace geometry
    • 8mil to 12mil trace width
    • Lengths less than 12cm to minimize transmission line effects
    • Avoid 90° corners for signal traces
    • Use an unbroken ground plane below signal traces
    • Flood fill areas around signal traces with ground
    • Parallel traces must be separated by at least 3x dielectric thickness
    • For traces longer than 12cm
      • Use impedance controlled traces
      • Source-terminate using a series damping resistor near the output
      • Avoid branches; buffer each signal that must branch separately