SCLS237N October   1995  – September 2015 SN54AHCT08 , SN74AHCT08

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Simplified Schematic
  5. Revision History
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Switching Characteristics, VCC = 5 V ± 0.5 V
    7. 7.7 Noise Characteristics
    8. 7.8 Operating Characteristics
    9. 7.9 Typical Characteristics
  8. Parameter Measurement Information
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Related Links
    2. 13.2 Community Resources
    3. 13.3 Trademarks
    4. 13.4 Electrostatic Discharge Caution
    5. 13.5 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|14
  • RGY|14
  • DB|14
  • DGV|14
  • PW|14
  • N|14
  • NS|14
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VCC Supply voltage range –0.5 7 V
VI Input voltage range(2) –0.5 7 V
VO Output voltage range(2) –0.5 VCC + 0.5 V
IIK Input clamp current VI < 0 –20 mA
IOK Output clamp current VO < 0 or VO > VCC ±20 mA
IO Continuous output current VO = 0 to VCC ±25 mA
Continuous current through VCC or GND ±50 mA
Tstg Storage temperature range –65 150 °C
TJ Junction temperature 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input and output voltage ratings may be exceeded if the input and output current ratings are observed.

7.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 500-V HBM is possible with the necessary precautions.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 250-V CDM is possible with the necessary precautions.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)(1)
SN54AHCT08 SN74AHCT08 UNIT
MIN MAX MIN MAX
VCC Supply voltage 4.5 5.5 4.5 5.5 V
VIH High-level input voltage 2 2 V
VIL Low-level input voltage 0.8 0.8 V
VI Input voltage 0 5.5 0 5.5 V
VO Output voltage 0 VCC 0 VCC V
IOH High-level output current –8 –8 mA
IOL Low-level output current 8 8 mA
Δt/Δv Input transition rise or fall rate 20 20 ns/V
TA Operating free-air temperature –55 125 –40 125 °C
(1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI Application Report, Implications of Slow or Floating CMOS Inputs, (SCBA004).

7.4 Thermal Information

THERMAL METRIC(1) SN74AHCT08 UNIT
D (SOIC) DB (SSOP) DGV (TVSOP) N (PDIP)
14 PINS 14 PINS 14 PINS 14 PINS
RθJA Junction-to-ambient thermal resistance 97.5 109.5 133.3 59.7 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 58.7 62.1 55.6 47.3 °C/W
RθJB Junction-to-board thermal resistance 51.8 56.9 66.3 39.5 °C/W
ψJT Junction-to-top characterization parameter 22.6 22.6 7.8 32.4 °C/W
ψJB Junction-to-board characterization parameter 51.6 56.3 56.6 39.4 °C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, (SPRA953).

7.5 Electrical Characteristics

over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS VCC TA = 25°C SN54AHCT08 SN74AHCT08 UNIT
MIN TYP MAX MIN MAX MIN MAX
VOH IOH = –50 µA 4.5 V 4.4 4.5 4.4 4.4 V
IOH = –8 mA 3.94 3.8 3.8
VOL IOL = 50 µA 4.5 V 0.1 0.1 0.1 V
IOL = 8 mA 0.36 0.44 0.44
II VI = 5.5 V or GND 0 V to
5.5 V
±0.1 ±1(1) ±1 µA
ICC VI = VCC or GND, IO = 0 5.5 V 2 20 20 µA
ΔICC(2) One input at 3.4 V,
Other inputs at VCC or GND
5.5 V 1.35 1.5 1.5 mA
Ci VI = VCC or GND 5 V 4 10 10 pF
(1) On products compliant to MIL-PRF-38535, this parameter is not production tested at VCC = 0 V.
(2) This is the increase in supply current for each input at one of the specified TTL voltage levels, rather than 0 V or VCC.

7.6 Switching Characteristics, VCC = 5 V ± 0.5 V

over recommended operating free-air temperature range (unless otherwise noted) (see Figure 2)
PARAMETER FROM
(INPUT)
TO
(OUTPUT)
LOAD
CAPACITANCE
TA = 25°C SN54AHCT08 SN74AHCT08 UNIT
MIN TYP MAX MIN MAX MIN MAX
tPLH A or B Y CL = 15 pF 5(1) 6.9(1) 1(1) 8(1) 1 8 ns
tPHL 5(1) 6.9(1) 1(1) 8(1) 1 8
tPLH A or B Y CL = 50 pF 5.5 7.9 1 9 1 9 ns
tPHL 5.5 7.9 1 9 1 9
(1) On products compliant to MIL-PRF-38535, this parameter is not production tested.

7.7 Noise Characteristics

VCC = 5 V, CL = 50 pF, TA = 25°C(1)
PARAMETER SN74AHCT08 UNIT
MIN TYP MAX
VOL(P) Quiet output, maximum dynamic VOL 0.4 0.8 V
VOL(V) Quiet output, minimum dynamic VOL –0.4 –0.8 V
VOH(V) Quiet output, minimum dynamic VOH 4.4 V
VIH(D) High-level dynamic input voltage 2 V
VIL(D) Low-level dynamic input voltage 0.8 V
(1) Characteristics are for surface-mount packages only.

7.8 Operating Characteristics

VCC = 5 V, TA = 25°C
PARAMETER TEST CONDITIONS TYP UNIT
Cpd Power dissipation capacitance No load, f = 1 MHz 18 pF

7.9 Typical Characteristics

SN54AHCT08 SN74AHCT08 D001_SCLS237.gif
Figure 1. TPD vs Temperature