SCLS228M October   1995  – July 2014 SN54AHCT244 , SN74AHCT244

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Simplified Schematic
  5. Revision History
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Handling Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Switching Characteristics
    7. 7.7 Noise Characteristics
    8. 7.8 Operating Characteristics
    9. 7.9 Typical Characteristics
  8. Parameter Measurement Information
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Related Links
    2. 13.2 Trademarks
    3. 13.3 Electrostatic Discharge Caution
    4. 13.4 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DGV|20
  • DB|20
  • NS|20
  • N|20
  • DW|20
  • PW|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Inputs Are TTL-Voltage Compatible
  • Latch-Up Performance Exceeds 250 mA
    Per JESD 17
  • On Products Compliant to MIL-PRF-38535,
    All Parameters Are Tested Unless Otherwise Noted. On All Other Products, Production Processing Does Not Necessarily Include Testing of All Parameters.

2 Applications

  • Network Switches
  • Power Infrastructures
  • PCs and Notebooks
  • Wearable Health and Fitness Devices
  • Tests and Measurements

3 Description

These octal buffers/drivers are designed specifically to improve both the performance and density of
3-state memory-address drivers, clock drivers, and bus-oriented receivers and transmitters.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
SNx4AHCT244 PDIP (20) 25.40 mm x 6.35 mm
SOP (20) 12.60 mm x 5.30 mm
SSOP (20) 7.50 mm x 5.30 mm
TVSOP (20) 5.00 mm x 4.40 mm
TSSOP (20) 6.50 mm x 4.40 mm
  1. For all available packages, see the orderable addendum at the end of the data sheet.

4 Simplified Schematic

logic_cls228.gif