SCES552E February   2004  – August 2020 SN74AVC24T245

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Switching Characteristics
    7. 6.7  Switching Characteristics
    8. 6.8  Switching Characteristics
    9. 6.9  Switching Characteristics
    10. 6.10 Switching Charactertistics
    11. 6.11 Operating Characteristics
    12. 6.12 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Fully Configurable Dual-Rail Design Allows Each Port to Operate Over the Full 1.2-V to 3.6-V Power-Supply Range
      2. 8.3.2 Partial-Power-Down Mode Operation
      3. 8.3.3 VCC Isolation
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 EnableTimes
    3. 9.3 Typical Application
      1. 9.3.1 Design Requirements
      2. 9.3.2 Detailed Design Procedure
        1. 9.3.2.1 Input Voltage Ranges
        2. 9.3.2.2 Output Voltage Range
      3. 9.3.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
    2. 12.2 Related Documentation
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) SN74AVC24T245 UNIT
GRG ZRG NMU
83 83 83
R θJA Junction-to-ambient thermal resistance 38.1 38.1 44.3 °C/W
R θJC(top) Junction-to-case (top) thermal resistance 22.8 22.8 24.5 °C/W
R θJB Junction-to-board thermal resistance 17.0 17.0 29.1 °C/W
ψ JT Junction-to-top characterization parameter 0.44 0.44 0.5 °C/W
ψ JB Junction-to-board characterization parameter 16.9 16.9 29.2 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.