SCES693G February   2008  – May 2021 SN74AVC4T774

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Description (continued)
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics
    6. 7.6  Switching Characteristics: VCCA = 1.2 V ± 0.1 V
    7. 7.7  Switching Characteristics: VCCA = 1.5 V ± 0.1 V
    8. 7.8  Switching Characteristics: VCCA = 1.8 V ± 0.15 V
    9. 7.9  Switching Characteristics: VCCA = 2.5 V ± 0.2 V
    10. 7.10 Switching Characteristics: VCCA = 3.3 V ± 0.3 V
    11. 7.11 Typical Characteristics
  8. Parameter Measurement Information
    1. 8.1 Load Circuit and Voltage Waveforms
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Fully Configurable Dual-Rail Design Allows Each Port to Operate Over the Full 1.1-V to 3.6-V Power-Supply Range
      2. 9.3.2 Support High-Speed Translation
      3. 9.3.3 Ioff Supports Partial-Power-Down Mode Operation
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curve
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Receiving Notification of Documentation Updates
    3. 13.3 Support Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Layout Guidelines

To ensure reliability of the device, following common printed-circuit board layout guidelines are recommended:

  • Bypass capacitors should be used on power supplies.
  • Short trace lengths should be used to avoid excessive loading.
  • Placing pads on the signal paths for loading capacitors or pullup resistors to help adjust rise and fall times of signals depending on the system requirements