SCDS145C October   2003  β€“ June 2018 SN74CB3Q3253

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Logic Diagram (Positive Logic)
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • PW|16
  • DBQ|16
  • RGY|16
  • DGV|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Thermal Information

THERMAL METRIC(1) SN74CB3Q3253 UNIT
DBQ
(SSOP)
DGV
(TVSOP)
PW
(TSSOP)
RGY
(VQFN)
16 PINS 16 PINS 16 PINS 16 PINS
RθJA Junction-to-ambient thermal resistance 114.3 126 112.7 45.7 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 65.4 51.3 47.5 59.6 °C/W
RθJB Junction-to-board thermal resistance 56.8 57.8 57.85 23.3 °C/W
ψJT Junction-to-top characterization parameter 18.3 5.9 6 2.2 °C/W
ψJB Junction-to-board characterization parameter 56.4 57.3 57.3 23.4 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance n/a n/a n/a 11.5 °C/W
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.